TSMC will see its 12- and 8-inch fab capacities stay tight in 2021 and throughout 2022, and is gearing up for its next stage of growth, said company CEO CC Wei at an earnings earnings...
Taiwan-based display driver IC (DDI) backend specialists expect to post flat sequential revenue growth in the fourth quarter of 2021, as tight foundry capacity constrains their fabless...
TSMC is poised to comprehensively expand production capacities for both its 7nm and 28nm process technologies, in addition to its planned 5nm process expansion, which may prompt the...
China-based Zing Semiconductor is expected to see its monthly production for 12-inch silicon wafers ramp up to one million pieces by 2025 from the current level of 250,000, according...
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
China-based Semiconductor Manufacturing International (SMIC) has disclosed it has struck a deal with the administrative committee of the Lingang Free Trade Zone (FTZ) under which...
NAND flash device controller chip prices are under increasingly upward pressure, as foundries are set to initiate further price hikes for mature process technologies later this year...
TSMC has notified clients an about 10% price hike for its sub-16nm process manufacturing, with the new prices set to be effective starting 2022, according to sources at IC design...
United Microelectronics (UMC) has notified clients prices for its 28nm and 22nm process manufacturing will be adjusted upward in September and November 2021, and again in January...
The global NAND flash memory market is expected to reach the balance of supply and demand in 2022, when the overall bit supply growth is expected to stay at about 30%, according to...
GlobalFoundries (GF) reportedly has quietly applied to US Securities and Exchange Commission for an IPO (initial public offering) listing on New York Stock Exchange in late 2021 or...
China's top-3 backend houses JCET, Tongfu Microelectronics, and Tianshui Huatain Technology are all set to gain big from robust packaging demand in the second half of the year, having...
Having already raised its quotes for 28nm process technology, TSMC has moved to maintain the prices throughout the second half of this year, according to industry sources.
