The available capacity for 28nm mobile chips at IC foundries, mainly Taiwan Semiconductor Manufacturing Company (TSMC), has become sufficient to meet demand since early 2013. Suppliers...
Qualcomm and TSMC have jointly announced that Qualcomm's wholly-owned subsidiary, Qualcomm Technologies, will be the first company to produce working silicon on TSMC's 28nm HPM (high...
Taiwan Semiconductor Manufacturing Company (TSMC) continues to achieve full utilization of 28nm capacity, thanks to strong orders for mobile devices, according to industry sources.
Taiwan's top-3 IC foundries will see their combined revenues register an about 0.8% sequential drop in the first quarter of 2013, compared to the larger 5.1% on-quarter decrease posted...
Foundry service provider United Microelectronics Corporation (UMC) has lagged behind schedule in hiking the proportion of total revenues from 28nm technology, and the proportion is...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...
Taiwan Semiconductor Manufacturing Company (TSMC) reportedly has demanded its equipment suppliers deliver in advance the front-end equipment needed for its 28nm process due to brisk...
United Semiconductor (UMC) has delivered samples of Qualcomm's new 28nm chips for verification, and is competing with Globalfoundries to be the second 28nm foundry partner for Qualcomm...
Shares of Taiwan Semiconductor Manufacturing Company (TSMC) have rallied on reports indicating the IC foundry will likely grab orders for Apple's A-series processors earlier than...
Testing house STATS ChipPAC Taiwan Semiconductor, a subsidiary of Singapore-based STATS ChipPAC, is expected to enjoy a particularly strong first quarter of 2013 buoyed by strong...
Taiwan-based IC backend services companies will benefit from an increase in capital expenditure (capex) by Taiwan Semiconductor Manufacturing Company (TSMC) in 2013, according to...
In first-half 2012, Taiwan Semiconductor Manufacturing Company (TSMC) saw its 28nm process lacking enough capacity, forcing customers such as Qualcomm to shift orders to United Microelectronics...
IC packaging and testing house Advanced Semiconductor Engineering (ASE) is expected to post an only a single-digit sales drop sequentially in the first quarter of 2013, compared to...
United Microelectronics (UMC) will move to aggressively develop 14nm process technology featuring FinFET 3D transistors, according to company CEO Shih-Wei Sun. Deploying Finfet transistor...
United Microelectronics (UMC) saw its revenues increase about 3% sequentially in the third quarter of 2012, despite having lower shipments for the quarter, according to the foundry...
