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NEWS TAGGED 28NM
Monday 11 January 2010
Qualcomm, TSMC extend collaboration to 28nm
Taiwan Semiconductor Manufacturing Company (TSMC) on January 8 announced its partnership with Qualcomm has been extended from 65nm and 45nm technologies to 28nm, only a day after...
Tuesday 5 January 2010
TSMC purchases US$4.5 billion worth of equipment in 2009
Taiwan Semiconductor Manufacturing Company (TSMC) spent more than NT$145 billion (US$4.57 billion) on machinery equipment in 2009, while rival United Microelectronics Corporation...
Wednesday 7 October 2009
ARM and Globalfoundries establish strategic partnership on 28nm HKMG process
ARM and Globalfoundries have announced a long-term strategic relationship to provide their mutual customers with an innovative SoC enablement program. To support the long-term relationship,...
Friday 2 October 2009
TSMC maintains 18-inch wafer tape-out in 2012
Taiwan Semiconductor Manufacturing Company (TSMC) will maintain its plans to begin trial production on 18-inch wafers in 2012 despite a conservative outlook prevailing across most...
Wednesday 30 September 2009
UMC focusing R&D on 28nm, 22nm processes
United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...
Monday 31 August 2009
Chartered to start 32nm pilot runs in 4Q09, sources say
Chartered Semiconductor Manufacturing is scheduled to launch its 32nm process technology in the fourth quarter of 2009, and move to 28nm in the first half of 2010, industry sources...
Thursday 27 August 2009
Fujitsu Microelectronics and TSMC cooperate on 28nm
Fujitsu Microelectronics and Taiwan Semiconductor Manufacturing Company (TSMC) on August 27 announced that they have agreed to collaborate on 28nm process technology targeting foundry...
Tuesday 25 August 2009
TSMC adds new member to 28nm roadmap
Taiwan Semiconductor Manufacturing Company (TSMC) has announced it is adding a low-power process to its 28nm high-k metal gate family, and is on track to deliver these new foundry...
Tuesday 4 August 2009
TSMC promoting OIP by combining EDA, IP
Taiwan Semiconductor Manufacturing Company (TSMC) is making efforts to make its OIP (Open Innovation Platform) - a technology platform for integrated services from IC design to manufacturing...
Friday 31 July 2009
TSMC CEO claims improved 40nm yield, predicts better 3Q09
Taiwan Semiconductor Manufacturing Company (TSMC) has issued positive guidance for the third quarter of 2009, following its improved second-quarter earnings that underline the chip...
Wednesday 22 July 2009
TSMC unveils reference flow for 28nm
Taiwan Semiconductor Manufacturing Company (TSMC) has unveiled its Reference Flow 10.0 for the 28nm process technology, delivering innovations to enable system-in-package (SiP) des...
Tuesday 14 July 2009
Globalfoundries calls for renewed focus on 300mm
The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....
Thursday 18 June 2009
TSMC ready to deliver full-node 28nm in early 2010
Taiwan Semiconductor Manufacturing Company (TSMC) has announced development of its 28nm low-power technology that extends Silicon Oxynitride (SiON)/poly usage beyond 32nm with a dual/triple...
Friday 5 June 2009
Globalfoundries says 45nm yields improved, on track to ramp 28nm by 2011
Globalfoundries is scheduled to break ground for its new facility (Fab 2) at the Luther Forest Technology Campus in New York in July, according to Tom Sonderman, the foundry's vice...
Monday 25 May 2009
TSMC on track to enter production at 28nm
Taiwan Semiconductor Manufacturing Company (TSMC) is set to unveil Reference Flow 10.0 for the 28nm process at the upcoming Design Automation Conference (DAC) in July 2009, according...
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