Taiwan Semiconductor Manufacturing Company (TSMC) is on schedule to implement its 2-nanometer node with the Gate-All-Around (GAA) technology, according to its supply chain partners,...
At the close of 2023, it's reported that TSMC and Samsung will delay the mass production of 4nm chips at their new fabs in the US from 2024 to 2025, posing a challenge to the Biden...
Intel has reportedly acquired 6 high-NA EUV lithography machines from ASML, which is scheduled for shipment in 2024, according to South Korean media outlets. Intel's fast adoption...
TSMC has tentatively set its production plan in Taiwan from 2024 to 2029, covering 2nm that will primarily take place at its new fabs in Baoshan in northern Taiwan and Kaohsiung in...
Japan's chipmaking startup, Rapidus, is setting ambitious goals to mass-produce 2nm chips by 2027, aiming to provide the world's fastest chip manufacturing services, targeting clients...
TSMC is expected to start equipment move-ins at its new chip plant in Kaohsiung, Southern Taiwan in the third quarter of 2025, followed by pilot runs at the end of the year, according...
Customers for TSMC's 3nm and 2nm processes are unlikely to shift orders due to the increased difficulty of process technology and TSMC's one-stop service that includes backend advanced...
TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...
Socionext has announced a partnership with Arm and TSMC to develop an innovative, power-optimized 32-core CPU chiplet in TSMC's 2nm silicon technology, enabling scalable performance...
Starting 2024, Taiwan will implement a 10-year chip-driven industrial innovation project aiming to attract young talent and startup teams from around the world to set up operations...
Mesoscope Technology, one of the world's top three leading manufacturer of nano probes, has seen significant growth. Its latest 2–5nm probes have gained widespread adoption...
Rapidus recently held a groundbreaking ceremony at Chitose Bibi World, an industrial park in Chitose City, Hokkaido, where its IIM-1 fab to develop and manufacture advanced semiconductors...
As TSMC and Intel announced in succession that they are conducting R&D for the back-side power delivery network (BSPDN) technology, Samsung Electronics recently shared the current...
Intel has struck a deal with the US Department of Defense to develop and manufacture chips with its 18A (18-angstrom or 1.8nm) process technology under the DoD's Rapid Assured Microelectronics...
