Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...
TSMC has seen its capacity utilization rates for advanced processes below 7nm rebound slowly since June, and is poised to embrace a new wave of chip demand growth in 2024 as major...
Samsung Electronics and SK Hynix have revealed the latest development trends for advanced logic chips technology and memory products at recent technology symposiums, with the former...
Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has reiterated its close collaboration with significant North American clients, which will become evident in the third...
MediaTek plans to introduce its first 3nm automotive chip in 2024, followed by mass production as early as 2025, according to Jerry Yu, senior VP and GM of the company's CCM divisi...
EDA specialist Synopsys has recently announced its collaboration with TSMC to deliver digital and custom design EDA flows on the foundry's most advanced N2 (2nm) process, aiming to...
TSMC will see the baseline 3nm process technology (N3B) dominate 90% of its N3 family capacity in 2023, and nearly 90% of the N3B capacity reportedly has been booked by Apple for...
TSMC disclosed at its annual technology symposium in Taiwan that its overseas sub-28nm process manufacturing capacity in 2024 will be multiple times that of 2020.
For the first time ever, Samsung Electronics recently has bluntly publicized that its own AI server processors will surpass Nvidia's, but industry observers said regarding its major...
The high cost of manufacturing processes smaller than 3nm and related investments is posing a challenge to TSMC and its Korean and US peers, who are attempting to maintain adequate...
TSMC has obtained 3nm chip order commitments from vendors including AMD, MediaTek, Nvidia, and Qualcomm, which are all looking to defer the delivery of their 3nm generation devices,...
