Amidst the US trade sanctions and restrictions on technology exports, China's leading foundry SMIC (Semiconductor Manufacturing International Corporation) has not only been significantly...
SMIC is said to have set up a new semiconductor production line in Shanghai and hopes to utilize its existing US and Dutch manufacturing facilities to mass-produce Huawei HiSilicon's...
The latest report by Wccftech pointed out that Huawei's new notebook (NB) PC L540 is equipped with the 5nm Kirin 9006C, an SoC with 8 cores. Chinese media ITHome...
With the ongoing US-China tensions, Huawei exemplified its ability to make 7nm chips without EUV equipment, and chip guru Burn Lin believes it's not surprising for Huawei to achieve...
TSMC not only offers advanced process manufacturing but also its advanced packaging for the recently released Microsoft Azure Maia 100 AI accelerator, according to industry sources...
TSMC expects to post revenues of between US$18.8 billion and US$19.6 billion in the fourth quarter of 2023, which is an 11.1% sequential increase at the midpoint. Gross margin and...
After Huawei's Mate 60 Pro, featuring the 7nm Kirin 9000S processor produced by SMIC, caused a stir, Dr. Burn-Jeng Lin, dean of the College of Semiconductor Research under Taiwan's...
Huawei's Mate 60 Pro recently made an unexpected debut, sparking curiosity among Chinese consumers that the model might not necessarily carry truly top-notch SoC specs. In a public...
Global Unichip, an IC design services provider partnering mainly with TSMC, has lowered its revenue growth forecast for 2023 to a single-digit percentage, according to a report by...
TSMC's deployments have been designed to minimize geopolitical risks, according to industry sources. The world's number-one pure-play foundry house is leading in advanced chip manufacturing...
TSMC expects to post revenues of between US$16.7 billion and US$17.5 billion in the third quarter of 2023, which is a 9.1% sequential increase at the midpoint. Gross margin and operating...
A breakthrough in ultra-high density heterogeneous integration has been achieved through an academic collaboration between Taiwan and the US as part of a research project under the...
Samsung Electronics has disclosed its latest advanced process development roadmap at the just-ended 2023 Samsung Foundry Forum, with plans to mass produce 2nm chips by 2025 and commercialize...
