Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors...
Compound semiconductors including third-generation ones GaN and SiC will play a crucial part in the emerging 6G, car-use or mobile LiDAR, and biometrics device applications, according...
Taiwan-based six-inch foundries including Advanced Microelectronic Products (AMPI), Episil Technologies, Mosel Vitelic and Nuvoton Technology have given supply priority to automotive,...
MCU specialist Nuvoton Technology, which has merged with Panasonic Semiconductor Solutions (PSCS), has reportedly notified customers about a 15% price hike for its contract manufacturing...
Foxconn (Hon Hai) Technology Group, through its NT$2.52 billion (US$90.67 million) acquisition of Macronix International's 6-inch wafer fab and equipment, will be able to meet a market...
Macronix International, a vendor of non-volatile memory (NVM), and EMS provier Hon Hai Technology Group (Foxconn) have announced the signing of an agreement for the former to sell...
MCU specialist Nuvoton Technology has seen the synergies from its 2019 acquisition of Panasonic Semiconductor Solutions (PSCS) start paying off, given its sharp revenue and profit...
GaAs IC foundries Win Semiconductors and Advanced Wireless Semiconductor Company (AWSC), and GaAs epi-wafer supplier Visual Photonics Epitaxy Company (VPEC) are all poised to log...
Taiwan's 6-inch fab operators have cut capacity supply to vendors of IT-use diodes since the start of July as they are prioritizing foundry support for MOSFETs, diodes and power management...
Six-inch wafer fabs have become acquisition targets of automotive power semiconductor companies, as well as Foxconn Electronics (Hon Hai Precision Industry) and Tesla, both of which...
Mask ROM and flash memory maker Macronix is close to striking a deal to sell its 6-inch fab in Taiwan. Tokyo Electron is named as the most likely buyer of the Macronix...
Macronix International is in the final stage of reaching an agreement with the buyer of its 6-inch wafer plant in northern Taiwan, according to industry sources.
Apple reportedly has decided to scale down the die size by 40-50% for VCSEL chips used in 3D face ID sensors for new iPhone and iPad devices to be rolled out later in 2021, a move...