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NEWS TAGGED ABF SUBSTRATE
Thursday 5 May 2022
AMD to roll out 5nm processors as early as September
AMD is expected to roll out its new-generation processors built using TSMC's 5nm process technology as early as September, according to industry sources.
Tuesday 26 April 2022
ABF substrate makers to see new capacity boost biz results in next 3 years
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
Wednesday 13 April 2022
ABF substrate makers thriving on brisk demand for datacenter applications
Robust ABF substrate demand for datacenter applications will boost revenues and profits at Taiwan-based suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect...
Thursday 7 April 2022
Unimicron, Nan Ya PCB see Kunshan lockdown slightly affect April revenues
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
Thursday 31 March 2022
TSMC to reiterate sales and capex outlook at upcoming investor meeting
TSMC is expected to reiterate its sales growth outlook for 2022 of 25-29% while maintaining its capex target this year of US$40-44 billion at its upcoming investor conference call...
Tuesday 22 March 2022
ABF substrate makers continue to see clients queue up for capacity
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
Thursday 17 March 2022
Zhen Ding looks to rank among world's top-5 IC substrate suppliers by 2030
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Tuesday 15 March 2022
Sputtering equipment supplier UVAT enjoys robust orders
Taiwan-based UVAT Technology, a supplier of etching and sputtering equipment, has enjoyed robust orders for fan-out panel-level packaging (FOPLP) and those placed for the manufacture...
Thursday 10 March 2022
TSMC, Unimicron to offer production solutions for Apple M1 Ultra
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...
Tuesday 8 March 2022
Apple Car reportedly may adopt ABF substrates from Korean maker
Apple reportedly is in talks with a Korean substrate maker for the supply of ABF-based FC-BGA substrates for processing Apple Car chip solutions, sparking concerns about which IC...
Friday 4 March 2022
Nan Ya PCB doubles capex budget for 2022
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
Thursday 3 March 2022
PCB equipment makers poised for thriving sales in 2022
Taiwan's PCB equipment makers are poised to embrace another prosperous year in 2022, as their full capacity utilization will persist through at least the end of the third quarter,...
Thursday 24 February 2022
Unimicron in talks about ABF substrate orders for 2027-2030
Unimicron Technology is already in talks with its major clients about ABF substrate orders for 2027-2030, as they seek to secure as much new capacity as possible through long-term...
Thursday 17 February 2022
Kinsus to expand production capacity for ABF substrates in 2022, 2023
Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing...
Tuesday 15 February 2022
Rising materials prices boost Nan Ya January revenue
Taiwan-based Nan Ya Plastics has reported revenues grew 2.1% sequentially and 20.2% on year to NT$35.27 billion (US$1.27 billion) in January 2022, buoyed by rising prices of its electronics...