India's efforts to build a semiconductor manufacturing ecosystem have seen numerous companies enter the semiconductor packaging segment. One of them, Kaynes SemiCon, has revealed...
At the recently concluded 2023 China International Semiconductor Summit held in Shanghai, senior executives from JCET and TSMC both emphasized the role of advanced packaging, yet...
IC testing interface specialist WinWay Technology is full steam ahead with new products, holding a "very optimistic" outlook for the second half of 2024, according to the Taiwan-based...
TSMC has made changes to its new fab projects in Taiwan, including the suspension of a planned advanced packaging fab in the Hsinchu Science Park (HSP) Tongluo site, according to...
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
TSMC has become the primary revenue backer of the Southern Taiwan Science Park (STSP), as it is for the Hsinchu Science Park (HSP), which is nearly saturated with land, according...
China's JCET Group, a provider of IC backend manufacturing and technology services, reported revenue climbed 30.8% sequentially to CNY8.26 billion (US$1.13 billion).
Winbond Electronics, a specialty DRAM and flash memory maker, has expressed optimism about its business and market prospects for next year, noting the resolution of the majority of...
Intel is optimistic that for the first time in two years, fourth-quarter 2023 revenue will return to positive year-over-year growth, and that the PC market, which accounts for the...
Following the US sanction updates against Chinese semiconductor development on October 17, which established Total Processing Performance and Performance Density as the new parameters...
AI chips and co-packaged optics (CPO) will stimulate demand for advanced packaging in 2024, during which the semiconductor industry is expected to rebound.
High-speed data transmission has come into the spotlight along with cloud-based AI accelerator chips as one of the most vital capabilities in the electronics industry, and silicon...
Samsung Electronics has recently released its new-generation memory solutions aimed at the generative AI and large language model (LLM) markets, including the fifth-generation high-band...
