CONNECT WITH US
NEWS TAGGED ADVANCED PACKAGING
Friday 4 November 2022
TSMC capacity expansions facing potential changes with geopolitical influences
Despite TSMC's robust sales in the past few years and estimated strong performance in 2023, geopolitical tensions will continue to influence the foundry's decision in capacity expansion...
Thursday 3 November 2022
SEMICON China Forum: Find ways out under US trade ban
High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...
Wednesday 2 November 2022
3D IC packaging to develop faster under US trade sanctions against China, says AP Memory chair
For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...
Wednesday 2 November 2022
First-tier backend houses see falling capacity utilization rates
ASE Technology and other first-tier IC backend houses have seen their fab capacity utilization rates start loosening, as fabless clients have also begun to ask them to defer order...
Monday 31 October 2022
PTI plans 40% capex cut in 2023
Backend house Powertech Technology (PTI) expects its capex for 2023 to be about 40% lower than this year's level estimated at NT$17 billion.
Friday 28 October 2022
ASEH sees lower capacity utilization in 4Q22, cuts capex
OSAT ASE Technology Holding (ASEH) expects its capacity utilization rate to drop slightly in the fourth quarter of 2022, and has revised downward its capex outlook this year by about...
Wednesday 26 October 2022
Amkor signals auto semiconductor regional cluster strengthening in Europe
The semiconductor industry players are forming a regional cluster in Europe, with the support of EU's semiconductor initiative to decrease its dependence on Asia. Seeing growing demand...
Tuesday 25 October 2022
TSMC adds new variant to CoWoS packaging
TSMC is in talks with its major clients about the adoption of its new CoWoS-R+ packaging technology for HPC chips utilizing high-bandwidth memory such as HBM3, according to industry...
Friday 21 October 2022
TSMC sees utilization rates for advanced packaging loosen
TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due...
Wednesday 5 October 2022
Equipment supply and demand gap stabilizing for OSATs, IDMs: Q&A with K&S SVP Chan Pin Chong
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
Wednesday 21 September 2022
AMD keen to secure capacity support from Taiwan
AMD CEO Lisa Su will meet with her TSMC counterpart CC Wei during her upcoming visit to Taiwan, as the US chip vendor looks to secure support from the foundry house and other value...
Wednesday 21 September 2022
AMD CEO to visit Taiwan in early October
AMD chair and CEO Lisa Su will arrive in Taiwan in early October to meet major suppliers including TSMC and ASE Technology, according to industry sources.
Monday 19 September 2022
MediaTek to mass produce HPC chips with CoWoS tech in 2023
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Friday 16 September 2022
Equipment demand for advanced packaging stays robust
Equipment demand for mid- to high-end flip-chip (FC) and other advanced packaging remains robust, while demand for conventional wirebonding packaging is slowing down, according to...
Tuesday 13 September 2022
Nvidia and TSMC partner to develop silicon photonics solutions, sources say
TSMC is involved in an R&D project led by Nvidia to use its silicon photonic (SiPh) integration technology called COUPE (compact universal photonic engine) for graphics hardware...