Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which...

Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.

ASE Technology with its advanced packaging capability is eyeing a bigger presence in the field of server and network chips, and expects to post revenue growth in 2022.

Handset chips supply chain players share the view that their 2022 shipments for the segment will at best stay flat at 2021 levels, but HPC chip demand will continue to grow for datacenter,...

Advanced Semiconductor Engineering (ASE), a member of ASE Technology, has introduced VIPack as its family of vertically integrated package solutions including 3D heterogeneous integration...

TSMC is poised to boost its ties with memory chip vendors including Micron Technology and SK Hynix to strengthen the logic foundry's 3D silicon stacking and other advanced packaging...

System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...

Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server...

Labor and talent shortages will become a new normal for the semiconductor industry, and how to leverage AI, automation and systematization technologies to address diverse market needs...

While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...

While chip manufacturing technology continues to advance toward sub-5nm processes, advanced packaging also has been widely recognized as a key segment to progress drastically with...

TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...

Fab toolmaker All Ring Tech has landed significant orders from chipmakers, such as TSMC and ASE Technology, which have stepped up their advanced packaging capacity expansions, according...

Intel is evaluating a revision to its blueprints for the 14th Gen Core "Meteor Lake" CPUs by turning to TSMC's 5nm process family to manufacture all of the integrated chips, according...

With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...