ESD (electrostatic discharge) protection components have become increasingly crucial peripheral chips for handset and metaverse devices, spurring great demand for micro-packaging...

TSMC has introduced its N4X process technology, tailored for the demanding workloads of high performance computing (HPC) products.

Taiwan-based IC backend equipment specialists, particularly those specializing in advanced packaging equipment, are poised to generate record-high sales in 2021, buoyed by robust...

OSAT company ASE Technology has disclosed plans to sell part of its factory operations in China for over US$1 billion.

TSMC's 3DFabric family of 3D silicon stacking and advanced packaging technologies is in the next stage of its development, advancing from system integration to system scaling, according...

In the notebook processor supply chain, ABF substrates will be among certain components that will see shortage widen in 2022, which may tighten supply of notebook processors affecting...

ASE Technology expects market conditions in 2022 to remain favorable to it and other OSATs, and is upbeat about its ASP growth next year as automotive chips wirebonding business and...

China's National Semiconductor Industry Investment Fund (aka the Big Fund) continues to pour money into China's domestic fab toolmakers, looking to rev up the development of China's...

Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...

TSMC is expected to kick off equipment move-in at its new advanced packaging fab in Chunan, northern Taiwan later in the second half of this year, according to a report by Taiwan's...

ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...

TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...

Taiwan-based UVAT Technology, a supplier of etching and sputtering equipment, expects robust demand for advanced packaging and ABF substrate manufacturing to drive its revenue growth...

China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...

At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...