AI-based system-level testing (SLT) solutions will be increasingly needed to support new chipsets and modules for server, industrial control and automotive applications, according...
Taiwan-based display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies plan to procure additional high-end testing equipment, mainly from Japan's...
Display driver IC (DDI) backend houses Chipbond Technology and ChipMOS Technologies both plan to raise their quotes by 10-20% later in the first quarter of 2022, according to industry...
OLED display drive IC (DDI) demand for handset and automotive applications is set to grow sharply in 2022 allowing DDI backend specialists ChipMos Technologies and Chipbond Technology...
It will take at least six months for Advantest to deliver its high-end SoC testing equipment as shortage of key chip components needed to power the equipment has constrained the company's...
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec are all expected to post a particularly strong first quarter of 2022, as...
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies have enjoyed a ramp-up in orders for handset-use TDDI chips, with clear order visibility...
The supply of display driver ICs has fallen short of demand, while capacities at 8-inch foundries stay tight. Backend houses are mulling raising their quotes to reflect the tight...
With the advent of the 5G era, global DRAM bit-based consumption is expected to approximately double by 2023, and wafer-level memory burn-in test services will become increasingly...
Semiconductor test equipment supplier Advantest is presenting its latest solutions for 5G, next-generation memory, automotive and power device applications during the Semicon Taiwan...
Testing demand for high-end 5G SoCs has emerged and that for memory chips is set to pick up in early 2020, which will drive revenue increases at Advantest, a major Japan-based supplier...
