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NEWS TAGGED AI APPLICATIONS
Thursday 19 December 2024
Urtopia to debut lightweight e-bike innovations and AI voice assistant at CES 2025
Urtopia, recognized as a leader in lightweight e-bike design, will showcase its latest advancements in cycling technology at CES 2025. The company is set to unveil the Urtopia...
Wednesday 11 December 2024
Taiwanese IC distributors evolve into service providers amid market shifts
Artificial intelligence (AI) applications are the main driver in the semiconductor market in 2024, as challenges linger in other segments including consumer electronics, PCs, and...
Wednesday 11 December 2024
AI applications boosting on-site storage demand
According to Pure Storage Taiwan Country Manager Jeffrey Chow, the AI boom is driving demand for storage, with many companies choosing to store their important data on-site instead...
Monday 9 December 2024
eNeural introduces AI-Craft, a slimmed-down high-performance solution for edge AI
Continuing advances in AI technologies are driving a rapid expansion of AI applications into areas such as smart factories and smart cities. Coupled with the widespread popularity...
Tuesday 3 December 2024
Arm aims beyond semiconductors, targeting AI hardware, software, ecosystem
Arm CEO Rene Haas has openly expressed his aspirations for AI, envisioning that all future AI applications will run on Arm technology in some form. This strategic shift suggests that...
Monday 2 December 2024
Aaeon sees gradual recovery in 2025 as inventory destocking bottoms out
Aaeon Technology faced headwinds in 2024 as weak demand slowed inventory clearance, but CEO Howard Lin anticipates recovery beginning in the fourth quarter of 2024 when customers...
Friday 29 November 2024
IPC maker Neousys anticipates defense sales to rise in 2025
Neousys Technology has defied the downward trend in the industrial PC (IPC) industry in 2024, achieving solid revenues and profits through its early investments in edge AI computing...
Tuesday 26 November 2024
HPE unveils groundbreaking supercomputing lineup with fanless liquid cooling
Hewlett Packard Enterprise (HPE) has rolled out a new portfolio anchored by the HPE Cray Supercomputing EX system, debuting the industry's first fully fanless direct liquid cooling...
Tuesday 26 November 2024
Taiwan's supply chain is vital to global AI ecosystem, says Microsoft CVP
Taiwan's role in the global AI ecosystem cannot be overstated, according to Paul Lorimer, corporate VP of Office 365 Enterprise and cloud engineering at Microsoft.
Tuesday 26 November 2024
Nvidia's AI ambitions seek sovereign boost
Nvidia's recent earnings paint a mixed picture of the AI chip giant's trajectory. While quarterly revenue continued to climb sequentially, annual growth slowed to 70% from 90% in...
Thursday 14 November 2024
Zhen Ding targets 70% revenue from AI applications by 2025, expands across four key sectors
Zhen Ding Technology (ZDT), a leading PCB manufacturer, reported record third-quarter revenue across key sectors, forecasts continued growth in the fourth quarter, and targets significant...
Wednesday 13 November 2024
Apple may seek Foxconn's global capacity for AI servers
The rise of ChatGPT and other AI applications has driven IT companies to develop their own AI chips and servers, to meet the growing needs of both cloud-based services and edge devices...
Wednesday 13 November 2024
Passive component company Podak enters AI server supply chain amid 2025 demand shifts
As artificial intelligence (AI) demand grows and recent financial issues at Supermicro trigger order redistribution, passive component manufacturer Podak sees new opportunities. Chairperson...
Friday 8 November 2024
Burgeoning automotive, AI applications drive growth for non-OEM PCB player Eikei
Taiwan-based Eikei, a specialist in non-OEM PCBs, is poised for substantial growth in both revenue and profit in 2025, driven by increasing demand for PCBs in automotive, AI, and...
Tuesday 5 November 2024
AUO pivots to silicon photonics over FOPLP race
AUO has said they are focusing on silicon photonics opportunities while holding onto its cautious approach panel-level fan-out packaging (FOPLP), a notable divergence from its rivals...