A state-backed Chinese think tank recently released a report suggesting that data centers should continue using AI chips from Nvidia due to the high costs associated with switching...
TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry...
Reports suggest that the Chinese government is discouraging local companies from purchasing Nvidia's AI chips, which may affect Samsung Electronics' High Bandwidth Memory (HBM) sales...
The release of Generative AI has rapidly ignited a global frenzy. While developing large language models (LLMs) is crucial, the real game-changer is executing AI inference tasks on...
The rapid development of the global generative AI market is driving unprecedented transformation in the semiconductor industry. DIGITIMES Research's latest AI Chips Special Report...
The 2024 China Computing Power Conference highlighted the ongoing challenges in China's AI computing capabilities. Experts emphasized the need to address China's computing power gap...
At the 2024 China Computing Power Conference, Xiao-hui Yu, President of the China Academy of Information and Communications Technology (CAICT), analyzed the newly released "China...
Google's innovative approach of using artificial intelligence to design AI chips is revolutionizing the semiconductor industry. The key to their AlphaChip system lies in its reinforcement...
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Thermal management has become an increasingly critical issue as the computing performance of AI chips continues to advance. High temperatures not only lead to slower performance due...
RISC-V, according to Frankwell Lin, chairman of Andes Technology and chairperson of Taiwan's RISC-V Alliance, provides a variety of advantages, such as flexibility and openness, in...
Shanghai Enflame Technology, a Chinese AI chip company backed by Tencent, has recently filed its intention to IPO with the Shanghai Bureau of the China Securities Regulatory Commis...
