Samsung Electronics emerged as the leader in the global semiconductor market (excluding foundry) in the first quarter of 2024, capturing an 11% market share by sales value, according...
The Ultra Accelerator Link (UALink) alliance, which saw the gathering of many IT giants, is committed to challenging the NVLink ecosystem, an AI chip accelerator interconnect technology...
Malaysia is fast becoming a semiconductor hub in Southeast Asia, with efforts being devoted particularly to expanding its advanced packaging, IC design, and AI sectors.
Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half...
ByteDance Ltd. and Broadcom Inc. have discussed a potential collaboration on an AI processor to help bolster the TikTok parent's development of that technology.
Since the beginning of May, several well-known Large Language Model (LLM) enterprises in China have announced price reductions, including Aliyun, Baidu, KU Xiaofei, Tencent Cloud,...
IC distributor Weikeng Industrial has expressed optimism about the mid-to-long-term demand for automotive and AI device applications, estimating that supply chain inventory correction...
Order visibility for HBM memory has been extended until the first quarter of 2026, spurred by the AI boom, according to sources at Taiwanese memory makers.
Kunlunxin, a spin-off of Baidu's chip and architecture department, has just received investments from Beijing's Municipal AI Industry Investment Fund. It is the sixth AI-related investment...
Fan-out panel-level (FOPLP) packaging is gaining attention from semiconductor firms seeking extra capacity support, and two AI chip companies are in talks with OSATs about potential...
Rapidus chairman Tetsuro Higashi said the Japanese pure-play foundry that aims to mass-produce 2nm chips could achieve its revenue target 10 years earlier than planned, as the AI...
