CONNECT WITH US
NEWS TAGGED AI CHIP
Friday 11 October 2024
TSMC accelerates Fab AP8 project for CoWoS advanced packaging
TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry...
Wednesday 9 October 2024
Strong AI server demand to drive Taiwan ODMs growth in 4Q24
Increased shipments and new product launches from AI chip leaders such as Nvidia and AMD have driven a surge in September sales for AI server ODMs.
Monday 7 October 2024
China's restrictions on Nvidia chips drag Samsung's HBM into muddy water
Reports suggest that the Chinese government is discouraging local companies from purchasing Nvidia's AI chips, which may affect Samsung Electronics' High Bandwidth Memory (HBM) sales...
Monday 7 October 2024
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The release of Generative AI has rapidly ignited a global frenzy. While developing large language models (LLMs) is crucial, the real game-changer is executing AI inference tasks on...
Monday 7 October 2024
Rise of cloud and edge AI applications paves way for new semiconductor opportunities; wafer foundries become crucial, says DIGITIMES Research
The rapid development of the global generative AI market is driving unprecedented transformation in the semiconductor industry. DIGITIMES Research's latest AI Chips Special Report...
Friday 4 October 2024
China's AI compute power gap spurs rise of 10,000 GPU interconnected networks
The 2024 China Computing Power Conference highlighted the ongoing challenges in China's AI computing capabilities. Experts emphasized the need to address China's computing power gap...
Friday 4 October 2024
Chinese AI chips need to address 'fragmentation' to fully utilize computing power from clusters
At the 2024 China Computing Power Conference, Xiao-hui Yu, President of the China Academy of Information and Communications Technology (CAICT), analyzed the newly released "China...
Thursday 3 October 2024
AI-designed AI chip: Google's AlphaChip slashes chip design development time for MediaTek's Dimensity 5G
The integration of artificial intelligence (AI) in chip design has become a focal point in the semiconductor industry. Leading electronic design automation (EDA) companies, including...
Thursday 3 October 2024
Designing AI chips with AI, AlphaChip plays chip layout game
Google's innovative approach of using artificial intelligence to design AI chips is revolutionizing the semiconductor industry. The key to their AlphaChip system lies in its reinforcement...
Thursday 3 October 2024
TSMC's backend equipment suppliers benefit from AI chip demand
Strong AI chip demand has led to full utilization of TSMC's fab capacity, benefiting related suppliers such as Siliconware Precision Industries (SPIL) and equipment manufacturers...
Wednesday 2 October 2024
Inventec AI chip IP development comes to fruition
Inventec has already seen clients start volume production for AI chips leveraging its intellectual property (IP), according to the Taiwan-based ODM.
Wednesday 2 October 2024
Cerebras IPO signals growing challenge to Nvidia's AI chip dominance
As the largest beneficiary of the generative AI surge, Nvidia's dominance has attracted a wave of challengers. The recent initial public offering (IPO) filing by Cerebras signals...
Tuesday 1 October 2024
Huawei debuts Ascend 910C samples amid China's bid to topple Nvidia's AI lead
The Chinese government is reportedly intensifying efforts to discourage domestic companies from buying Nvidia AI processors, aiming to boost local suppliers like Huawei. According...
Tuesday 1 October 2024
Global 300mm fab equipment spending to hit US$400 billion from 2025 to 2027, says SEMI
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research