TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry...
Reports suggest that the Chinese government is discouraging local companies from purchasing Nvidia's AI chips, which may affect Samsung Electronics' High Bandwidth Memory (HBM) sales...
The release of Generative AI has rapidly ignited a global frenzy. While developing large language models (LLMs) is crucial, the real game-changer is executing AI inference tasks on...
The rapid development of the global generative AI market is driving unprecedented transformation in the semiconductor industry. DIGITIMES Research's latest AI Chips Special Report...
The 2024 China Computing Power Conference highlighted the ongoing challenges in China's AI computing capabilities. Experts emphasized the need to address China's computing power gap...
At the 2024 China Computing Power Conference, Xiao-hui Yu, President of the China Academy of Information and Communications Technology (CAICT), analyzed the newly released "China...
The integration of artificial intelligence (AI) in chip design has become a focal point in the semiconductor industry. Leading electronic design automation (EDA) companies, including...
Google's innovative approach of using artificial intelligence to design AI chips is revolutionizing the semiconductor industry. The key to their AlphaChip system lies in its reinforcement...
Strong AI chip demand has led to full utilization of TSMC's fab capacity, benefiting related suppliers such as Siliconware Precision Industries (SPIL) and equipment manufacturers...
As the largest beneficiary of the generative AI surge, Nvidia's dominance has attracted a wave of challengers. The recent initial public offering (IPO) filing by Cerebras signals...
The Chinese government is reportedly intensifying efforts to discourage domestic companies from buying Nvidia AI processors, aiming to boost local suppliers like Huawei. According...
Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. The robust spending is being driven by the regionalization...
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...