Thermal management has become an increasingly critical issue as the computing performance of AI chips continues to advance. High temperatures not only lead to slower performance due...
RISC-V, according to Frankwell Lin, chairman of Andes Technology and chairperson of Taiwan's RISC-V Alliance, provides a variety of advantages, such as flexibility and openness, in...
Chinese GPU maker Biren Technology has recently filed for an upcoming IPO with the Shanghai Securities Regulatory Commission, following in the footsteps of Shanghai Enflame, another...
In artificial intelligence (AI), especially within deep learning and large-scale data processing, maintaining memory coherence is critical. AI models often rely on extensive parallel...
Shanghai Enflame Technology, a Chinese AI chip company backed by Tencent, has recently filed its intention to IPO with the Shanghai Bureau of the China Securities Regulatory Commis...
Amid Nvidia's recent record-breaking revenue, China's leading AI chipmaker, Cambricon Technologies, has not shared in the AI boom, reporting a more than 40% decline in revenue for...
In the current AI development trend, Nvidia is already dominating the leading position in the AI chip market and actively expanding its influence to data centers and related areas...
The British semiconductor delegation, composed of 24 firms led by the UK Government's National Technology Adviser Dave Smith, has made its splash at SEMICON for the second year in...
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
During a recent public discussion with Imec CEO Luc Van den Hove, MediaTek CEO Rick Tsai highlighted that there are still technical barriers to AI chip development, such as chip interconnect...
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
Major players in Nvidia's supply chain, such as global foundry leader TSMC, have good order visibility extending to 2026, despite stock investors' concern about the US chip vendor's...
Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging...
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
