After ChatGPT brought enthusiasm to the high-bandwidth memory (HBM) market, the competition between Samsung Electronics and SK Hynix is becoming increasingly intense. Following SK...
Chunghwa Precision Test Tech (CHPT), a provider of IC test interface solutions, expects a slower-than-expected sales rebound in the third quarter. The second half will still outperform...
TSMC is expected to see a significant revenue rebound in the second half of the year, which will be driven by not only the launch of new iPhones but also strong demand for AI chips...
The US is reportedly contemplating new restrictions on the supply of artificial intelligence (AI) chips to China, seeking to further curb the growth of China's semiconductor industry...
Due to the bandwidth limitations of DDR SDRAM in high-speed computation, high bandwidth memory (HBM) is rapidly gaining popularity as a means to circumvent memory transmission speed...
Samsung Electronics and SK Hynix are expected to see their memory production cuts significantly generate positive results in the second half of 2023, after experiencing a slowdown...
Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...
Large-size displays such as TVs have seen demand recover earlier than smaller ones for handset, notebook and other consumer electrics devices after becoming the first to enter inventory...
Heat spreaders have to be made bigger and thicker to support AI chips with a larger surface areas and higher performance, according to Jentech Precision Industrial president Chin-Lung...
AI chip market leader Nvidia is reportedly interested in testing SK Hynix's latest generation of high-bandwidth memory (HBM). If the two sides successfully collaborate, it will help...
TSMC has placed rush orders for CoWoS packaging equipment in order to meet surging demand for Nvidia's AI chips, according to sources at fab toolmakers.
TSMC is contemplating a 3 to 6 percent price increase for its advanced process manufacturing beginning in January 2024, according to sources at IC design houses. The price increases...
Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm...
