SLP (substrate-like PCBs) makers in the supply chain of Apple devices have ended their first wave of competition, with Taiwan's Zhen Ding Technology and Austria's AT&S each absorbing...
TSMC is expected to see orders for Apple's Macs based on its Arm-based silicon ramp up and contribute substantially to the foundry's wafer sales starting the second half of 2021,...
In order to cut costs, diversify production risks and better tap the Chinese market, Apple has allowed Chinese partners to play an increasingly important role in assembling diverse...
China-based AirPods assembler Luxshare Precision Industry has seen increasing presence in the supply chain of Apple devices, and may have a chance of winning Apple Watch assembly...
Taiwan's ODMs including Compal Electronics and Quanta Computer will continue to generate more revenues from non-notebook segments for further profit improvement in 2020 despite recent...
Nan Ya PCB returned to profitability in 2019, thanks to strong shipments of its high-end ABF substrates and an influx of new orders for SiP substrates.
The worldwide market for wearable devices grew 82.3% in the fourth quarter of 2019, reaching a new high of 118.9 million devices shipped, according to IDC.
IC backend and verification specialists in the supply chain of Apple devices have regained confidence in their revenue performances for 2020 as they are moving to deliver shipments...
Apple is mulling shifting more assembly orders for its new models slated for launch in the first half of 2020 to factories in Taiwan mainly to diversify production risks associated...
Taiwan's leading backend service provider ASE Technology Holding expects to register an average capacity utilization of 75-80% for the first quarter of 2020 and is optimistic that...
Leading original equipment manufacturers (OEMs) reduced their semiconductor spend in 2019, influenced by declining memory prices, according to Gartner. Apple took the top rank from...
Taiwan-based IC backend houses plan to implement their capacity expansion projects in 2020 to satisfy growing demand for more complex chip designs and high-end testing, according...
Apple has informed its upstream partners it will stop paying non-recurring engineering (NRE) fees for the development of new iPhones' chassis and metal frames, according to industry...
Global shipments of wearable devices totaled 84.5 million units in the third quarter of 2019, an on-year increase of 94.6% and a new record for shipments in a single quarter, according...
Taiwan's Kinsus Interconnect Technology and Nan Ya PCB are both reportedly among SiP (system in package) substrate suppliers for Apple's just-unveiled AirPods Pro series, which adopt...
