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NEWS TAGGED ASE
Tuesday 10 December 2024
PGC partners with TSMC and ASE to expand ASIC turnkey services in North America
PGC (Progate Group Corporation) has recently teamed up with North American strategic allies to meet the growing demand for advanced process technologies in AI, high-performance computing...
Monday 11 November 2024
ASE expands to Mexico with first North American packaging facility post-US election
ASE Holdings' North American subsidiary, ISE Labs, has announced a land acquisition in Guadalajara's Axis 2 industrial park, marking its first packaging facility expansion outside...
Friday 1 November 2024
ASEH steps up advanced packaging capacity expansion
OSAT ASE Technology (ASEH) has stepped up its pace of capacity expansion for advanced packaging to meet demand for AI device applications, which it anticipates to be a continual growth...
Wednesday 30 October 2024
Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
Tuesday 29 October 2024
TSMC's go-to partner for AI demand: ASE's SPIL invests US$13 million to boost CoWoS capacity
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
Tuesday 22 October 2024
Bright future ahead: advanced packaging takes center stage as traditional OSAT providers pivots
AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...
Friday 11 October 2024
ASE to boost advanced packaging capacity with new K28 plant
Advanced Semiconductor Engineering (ASE) is intensifying its development in the advanced packaging sector by establishing the new K28 plant in Kaohsiung, southern Taiwan. A groundbreaking...
Friday 6 September 2024
ASE establishes SiPhIA consortium, CEO Tien Wu sees accelerated progress in silicon photonics
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Wednesday 4 September 2024
SEMICON Taiwan 2024 forums to highlight CoWoS, FOPLP, SiPh
SEMICON Taiwan 2024 is set to take place from September 4 to 6 and will feature over 20 forums.
Tuesday 3 September 2024
Golden age of semiconductors has arrived, says ASEH COO
The semiconductor industry has entered its golden era, necessitating collaboration across the supply chain to overcome bottlenecks, according to Tien Wu, COO for OSAT ASE Technology...
Friday 30 August 2024
Global OSAT industry, 2024

Introduction

Friday 30 August 2024
Three issues remain following ASE's plans in Kyushu
Taiwan-based OSAT, ASE, signed a tentative contract with the government of Kitakyushu in Kyushu, Japan, to buy land in Kitakyushu's Wakamatsu-ku where they would attempt to expand...
Friday 30 August 2024
G2C+ alliance expects robust demand for advanced packaging
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
Tuesday 6 August 2024
Infineon completes sale of Philippines and South Korea backend sites to ASE
Infineon Technologies has completed the sale of its two backend manufacturing sites, one in Cavite, Philippines, and one in Cheonan, South Korea, to two fully owned subsidiaries of...
Friday 2 August 2024
ASEH to set up advanced packaging fab in Japan, say sources
ASE Technology Holding (ASEH) plans to follow in TSMC's footsteps by establishing an advanced packaging fab in Kyushu, Japan, according to industry sources.