Universal Scientific Industrial, an EMS subsidiary of ASE Technology, has successfully acquired 100% stake in Asteelflash Group from Financiere AFG (FAFG).

ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem,...

Raising backend service quotes is not necessarily the best practice for OSAT firms to counter ever-tighter capacity supply for wire bonding and flip chip packaging, as nothing is...

The US Department of Commerce reportedly will place another 89 Chinese tech firms on its MEU (military end user) control list including JCET's subsidiary STATS ChipPAC and IC distributor...

Bough Lin will resign as chairman of Siliconware Precision Industries (SPIL), according to ASE Technology, the parent company for SPIL.

IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand...

5G mmWave AiP (antenna in package) modules are on track to gain increasing penetration in handsets and other devices after being incorporated into iPhone 12 series, and FC-AiP technology...

Backend house ASE Technology has announced plans to recruit over 3,000 engineers and technicians for its factory complex in Kaohsiung, southern Taiwan seeking to better meet robust...

Taiwan's top OSAT firm ASE Technology will hike backend service quotes by 5-10% starting first-quarter 2021 to reflect increased cost and tight capacity supply for some products,...

ASE Technology has turned optimistic about the IC backend industry prospects for the first half of 2021 with high capacity utilization to linger in diverse processes despite the coronavirus...

Sony has been keen on developing car-use CIS applications, and it has added ASE Technology to its backend supply chain. ASE...

ASE Technology's development of its CMOS image sensor backend business has been in a low profile, unlike the development of its other offerings such as wirebonding and system-level...

ASE Technology reportedly has become Sony's second backend partner for processing automotive CMOS imaging sensors (CIS), marking its return to the CIS packaging segment following...

Taiwan supply chain players are gearing up for the game console replacement boom to be triggered by Sony's new-generation game console PS5 and Microsoft's Xbox Series X, according...

Taiwan's backend houses ASE and affiliated Siliconware Precision Industries (SPIL) reportedly have landed orders for Qualcomm's Snapdragon X60 modem chips while GaAs foundry Win Semiconductors...

The Wi-Fi 6 penetration rate is likely to advance to 50-60% in 2021 with the latest wireless communication standard increasingly adopted for handsets, routers and notebooks, prompting...

OSAT provider ASE Technology has expressed optimism about its operations in the fourth quarter of 2020 and next year, as its packaging capacity remains tight and ASPs will rise.

The current tight wire bonding (WB) packaging capacity at Taiwan's IC backend service firms is likely to last beyond the first quarter of 2020 thanks to strong demand from analog...

Apple's custom-designed ultra wideband (UWB) chip featured in the just-unveiled HomePod mini smart speaker is built using ASE Technology's SiP packaging technology, according to industry...

Backend house ASE Technology is expected to see its consolidated revenue consisting of sales generated by its core IC ATM (assembly, test and material) business and EMS subsidiary...

LCD driver IC and MOSFET chip prices are set to rise over 10% in fourth-quarter 2020 and will continue their rally in the following two quarters to reflect tight supply and rising...

Japan-based leadframe vendors have reportedly raised quotes for part of their products by about 15% to reflect rising material costs, but their peers in Taiwan have no intentions...

ASE Technology Holding has announced that Siliconware Electronics (Fujian), a wholly-owned subsidiary in China of its member firm Siliconware Precision Industries (SPIL), has been...

For the world, 2020 has been a roller-coaster year, but that has not dampend the prospects of some new tech applications such as mini LED backlighting which are expected to begin...

ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...