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NEWS TAGGED ASE
Friday 17 September 2021
Chipmakers working with partners to step up deployments in 5G RF devices
Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according...
Friday 17 September 2021
AiP packaging demand set to be stimulated by new iPhone
With the new-generation iPhones equipped with more antenna-in-package (AiP) modules, AiP packaging demand will be rising along with the iPhone sales, according to industry sources.
Wednesday 15 September 2021
OSATs busy with high-end backend services for new iPhones
Taiwan's OSATs including ASE Technology and Powertech Technology (PTI) are gearing up to extend high-end backend services for new iPhones and other Apple devices, and their momentum...
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Tuesday 7 September 2021
ASE steps up recruiting engineers for 5G, networking, automotive chips
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Friday 3 September 2021
Backend firms see robust demand for MEMS microphones, audio ICs
Taiwan's backend houses including ASE Technology, Greatek Electronics, Orient Semiconductor Electronics (OSE), Lingsen Precision Industries and Taiwan IC Packaging have seen clear...
Wednesday 1 September 2021
ASE, PTI making progress in PLP field
ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Monday 30 August 2021
OSATs to sustain tight testing capacity well into 2022
Taiwan's OSATs are expected to sustain tight capacity supply for chip probing and final test operations through 2022, as the visibility of their orders, particularly from international...
Monday 30 August 2021
Taiwan chip vendors to gain influence in 2022 with major advantages
Taiwan chip vendors including MediaTek will continue to play an influential role in the global high-tech sectors in 2022 with major advantages including strong IC design prowess,...
Tuesday 24 August 2021
China OSATs strengthen QFN packaging capability for car chips
China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...
Wednesday 18 August 2021
China top-3 OSATs hike quotes by 20-30% for rush orders
China's top-3 backend houses JCET, Tongfu Microelectronics, and Tianshui Huatain Technology are all set to gain big from robust packaging demand in the second half of the year, having...
Wednesday 18 August 2021
China smartphone AP shipments – 2Q 2021
Second-quarter 2021 smartphone application processor (AP) shipments to China-based vendors amounted to 218 million units, up 3% quarter-over-quarter.
Monday 16 August 2021
Sony to score big from vigorous PS5 sales in 2021
Demand for games consoles continues to gain momentum amid persistent stay-at-home activities, allowing Sony Interactive Entertainment (SIE) to score big from the sales of its next-generation...
Friday 13 August 2021
IC shortage to remain challenging in 2022, says ASE
A shortfall in the supply of ICs will persist and remain a challenge facing businesses in 2022, according to OSAT market leader ASE Technology.