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NEWS TAGGED ASE
Monday 17 January 2022
QFN packaging increasingly adopted for B2B networking chips
Taiwan suppliers of B2B networking chips are moving to adopt QFN technology for packing their products amid the growing shortage of substrates for FC (flip-chip) production, increasing...
Thursday 13 January 2022
Fab toolmaker Marketech to enjoy 20-30% revenue surge in 2022
Significant orders from TSMC, ASE Technology, and Win Semiconductors will boost revenues at fab toolmaker Marketech Technology in 2022; revenues are forecast to grow 20-30% on year,...
Thursday 13 January 2022
China OSATs to cut prices for MCU packaging in 1H22
China-based OSATs, including Jiangsu Changjiang Electronics Technology (JCET), plan to cut quotes for consumer MCU and other conventional chip packaging services in the first half...
Monday 10 January 2022
AMD latest 3D desktop processor to adopt TSMC SoIC technology
AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...
Thursday 6 January 2022
Taiwan OSAT, test interface vendors upbeat about demand for new processors
Taiwan-based OSATs and IC test interface solution providers are upbeat about demand for new processors unveiled by vendors including AMD and Nvidia for the next couple of years, according...
Monday 3 January 2022
Bullish sales not to be seen in all IC supply chains in 2022
Bullish performance seen across all semiconductor segments and players in almost the past two years will no longer remain in 2022, as chip demand will vary from segment to segment...
Wednesday 29 December 2021
Fan-out packaging demand to grow for mobile chips
Fan-out packaging demand will be rising, as Qualcomm and MediaTek reportedly are moving to adopt the technology for processing their handset-use APs and power management ICs (PMIC)...
Thursday 23 December 2021
Taiwan OSATs upbeat about orders for automotive, commercial chips
Taiwan-based IC backend houses have seen their international customers scale up orders for processing midrange and high-end chips for automotive and commercial device applications,...
Monday 20 December 2021
Apple reportedly moves to develop own RF chips
Apple is reportedly hiring talent to develop RF solutions, modem chips and other wireless semiconductors in house, sparking market concerns about possible impacts on its suppliers...
Friday 17 December 2021
Taiwan OSATs gearing up for MediaTek 5G mmWave chips
ASE Technology and other Taiwan-based OSATs are gearing up for MediaTek's 5G mmWave chips solutions slated for launch in 2022, according to industry sources.
Tuesday 14 December 2021
Taiwan supply chain braces for booming 3rd-gen semiconductor applications
Applications of third-generation semiconductors including SiC and GaN diodes, MOSFETs and related modules are set to take off in 2022, and Taiwan's semiconductor supply chain players...
Tuesday 14 December 2021
IC designers zero in on peripheral chips for WBG semiconductor modules
Taiwanese IC design houses have gradually expanded their deployments in the segment of wide-bandgap (WBG) semiconductors, but will place R&D focus on peripheral driver ICs rather...
Monday 13 December 2021
Foundry capacity to stay tight in 2022 as global IC shortage lingers
Foundry capacity supply will remain tight in 2022 as global IC shortage has yet to ease and IC designers continue to seek more capacity support, although demand for certain chips...
Tuesday 7 December 2021
Taiwan semiconductor players brace for GaN RF demand boom
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
Tuesday 7 December 2021
Taiwan OSAT firms adjusted production capacities; Shortage of automotive chips shows signs of easing
Taiwan-based OSAT services providers recently adjusted their production capacities either upward or downward. ASE Technology sold part of its factory operations in China to local...