ASE Technology Holding expects to generate sequential revenue growth through the fourth quarter of 2019, judging from a substantial pick-up in orders for communications chips.

The 5G iPhone may be coming a few weeks later than usual because of COVID-19 impacts, but development for Apple Watch 6 reportedly has been going smoothly, with ASE...

ASE Technology has obtained major backend orders for Apple Watch 6 slated for launch later this year, according to industry sources.

Intel is expected to step up its outsourcing of chips and processors, particularly GPUs and IoT chips, for years to come, according to sources at Taiwan-based outsourced assembly...

ASE Technology Holding has continued committing equity investments to build up its FC-AiP (flip chip-antenna in package) packaging capacity seeking to maintain its leading position...

Sony's new-generation PS5 game console shipments are estimated to reach at least 120 million units in the next five years after launch in fourth-quarter 2020, roughly double those...

Display driver IC backend specialists including ChipMos Technologies and Chipbond Technolofy are expected to enjoy a significant ramp-up in demand for handset applications, including...

Taiwan-based backend houses and IC test interface solutions providers have started scaling up their output for midrange 5G smartphone chips designed by MediaTek for the China market,...

Taiwan-based logic IC packaging firm Greatek Electronics, an affiliate of Powertech Technology (PTI), has indirectly cut into the supply chain of Sony's next-generation PS5 gaming...

Taiwan's leading backend house ASE Technology is expected to start volume production of ToF (time of flight)-based LiDAR (light detection and ranging) sensing modules in the second...

MediaTek's backend partners in Taiwan including ASE Technology, King Yuan Electronics and Sigurd Microelectronics will see clear order visibility stretching to at least the first...

Chinese chipmakers including Lansus Technologies, MeidaTek-affiliate Vanchip Technology, and Unisoc Communications under the Tsinghua Unigroup are keenly developing 5G RF-FEM products...

Leading IC backend house ASE Technology Holding saw its revenues for both second-quarter and first-half 2020 hit record highs, thanks mainly to high capacity utilization for wire...

Taiwan's IC designers are mulling raising quotes for TV SoCs and driver ICs amid increasingly tight supply as Korean vendors gradually quit production of LCD panels and TVs as well...

Taiwan's niche-type IC designer PixArt Imaging has tapped into the supply chain of Lego's third-generation Mindstorms robots for kids with diverse optical and MEMS sensors, according...

Backend houses are gearing up for shipments for Microsoft's upcoming Xbox Series game consoles slated to debut at the end of July, and expect shipments for the new consoles to peak...

Shipments of mmWave-enabled 5G iPhones slated for launch later this year are estimated to reach only 15-20 million units in 2020 compared to a previous supply chain estimate of 30-40...

Taiwan's backend firms are moving to increase capex in the second half of 2020 to expand capacity to fulfill additional orders from MediaTek which is strengthening presence in 5G...

Grand Plastic Technology (GPTC), specializing in wet process facilities, will see equipment orders for TSMC's new advanced packaging plant in Taiwan start generating revenues in 2021,...

MediaTek is likely to ship more than 80 million mobile SoCs for 5G handsets in 2020 mainly to Chinese handset vendors, which may push up its global market share in the segment to...

As optical sensors are increasingly applied to wearable devices, TWS (true wireless stereo) earphones, AR/VR headsets and healthcare devices, Taiwan's IC designers, III-V semiconductor...

Backend IC packaging and testing service providers will begin shipments of the customized SoCs designed by AMD specifically for PlayStation 5 (PS5) to their downstream partners in...

Apple is reportedly looking to incorporate ambient light sensors in new AirPods, with ASE Technology likely to land backend orders for packaging the ALS...

Taiwan's backend leader ASE Technology is poised to apply its SESUB (semiconductor embedded in substrate)-based SiP packaging technology to next-generation TWS (true wireless stereo)...

Apple is expected to incorporate ambient light sensors (ALS) in next-generation AirPods devices in the coming 1-2 years, and Taiwan's ASE Technology may handle the backend process...