Intelligo said it is aiming for double-digit revenue growth in 2027 as AI IP licensing and AI edge-computing ASICs expand its reach into smartphones, notebooks, earbuds, gaming consoles...
Wiwynn Corporation said AI server shipments will overtake general-purpose server shipments in the third quarter of 2026, with the two expected to account for roughly half each, while...
Qualcomm this week announced a multi-generation collaboration with Amazon to develop custom silicon for AI inference and high-performance optical connectivity for Amazon Web Services...
Realtek chairman Sun-Chien Chiu, who received an honorary fellowship from Taiwan's Industrial Technology Research Institute (ITRI) this week, said in a public interview that the company...
Asia Vital said August 2026 revenue rose to NT$512 million, up 29.10% year over year, as shipments of ASIC servers to a US cloud service provider customer continued to increase. The...
SEMIFIVE has begun mass production of HyperAccel's data center inference accelerator using Samsung Foundry's 4nm process, marking the Korean custom-silicon company's first large-scale...
Chunghwa Precision Test Technology said demand for AI and high-performance computing (HPC) is driving a surge in advanced testing interface business, while ASIC revenue is set to grow...
Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers,...
Nvidia and MediaTek are widening a global AI partnership that could reshape data center, edge, and PC hardware markets. MediaTek's US$3.9 billion overseas convertible bond sale, largely...
As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...
Server rail maker Repon began shipping Nvidia's Vera Rubin rack products in August 2026, with ASIC server rack rails set for mass production in September. The higher average selling...
The four major US cloud service providers (CSPs) have already rewritten their 2026 capital expenditure records, and ASIC vendors are increasingly confident that demand will remain...
Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...
