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NEWS TAGGED AUTOMOTIVE
Friday 23 July 2021
CWTC to embrace five golden years for leadframe sales
Taiwan's leading leadframe maker Chang Wah Technology (CWTC) is set to enjoy five golden years duing which supply will continue to fall short of demand, according to company chairman...
Friday 23 July 2021
Automotive IC IDMs in talks with OSATs about demand in 2022
First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...
Friday 23 July 2021
Foundries gearing up for robust automotive IC demand
Taiwan-based pure-play foundries including TSMC, United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) are all...
Friday 23 July 2021
TSMC ramping up output for automotive chips
TSMC will be ramping up its output for automotive chips through 2022, as the foundry has struck multiple contracts set to be fulfilled next year, according to sources at fabless ch...
Friday 23 July 2021
Strong demand for panels boosts Taiwan optoelectronics industry
Taiwan's optoelectronics industry in the first half of 2021 shows strong growth, compared to the same period in 2020, due to the large-scale stimulus plans from major economies and...
Thursday 22 July 2021
Apple, carmakers vying for more ICs
Apple has stepped up its chip purchases for the upcoming iPhones, while first-tier automotive component vendors in the supply chains of carmakers in Japan are also vying for more...
Thursday 22 July 2021
Taiwan to form car tech association
Several Taiwan-based ICT makers and associations will participate in establishing Taiwan Advanced Automotive Technology Development Association (TADA) soon, according to the initiator...
Wednesday 21 July 2021
Compeq keenly exploring PCB for non-CE applications
Taiwan's PCB maker Compeq Manufacturing is guardedly optimistic about its shipment prospects for the second half of the year, and will continue to diversify its target markets to...
Wednesday 21 July 2021
PCB maker Dynamic to commercialize new capacity later in 3Q21
Taiwan-based PCB maker Dynamic Electronics expects additional production capacity at its factory site in Huangshi, China to come online later in third-quarter 2021 and contribute...
Tuesday 20 July 2021
Automotive component and parts suppliers cautious about 2H21
Automotive component and parts suppliers are cautious about shipments in the second half of this year, despite brisk order visibility they have, according to industry sources.
Tuesday 20 July 2021
Taiwan foundries to see revenue hit another record in 3Q21
Taiwan-based pure-play foundries including TSMC, United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) are all...
Tuesday 20 July 2021
Is Intel eyeing global automotive IC foundry leadership?
Intel's reported US$30 billion bid to acquire Globalfoundries has called attention to whether Intel is eyeing to be the world's largest automotive IC foundry by combining GF's mature...
Monday 19 July 2021
Google, VW, Toyota keen to develop car operating systems
With software defined vehicles emerging as a new trend for the auto industry, automotive operating systems and software programs will become a new field of competition in the market,...
Friday 16 July 2021
ChipMOS, Chipbond may further raise backend quotes in 2H21
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Friday 16 July 2021
Edison Opto, EOI setting up LED automotive lighting module lines
LED packaging service provider Edison Opto is establishing two new production lines for LED automotive lighting modules in Taiwan, while LED automotive lighting module maker Excellence...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.