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Friday 3 December 2021
Taiwan ranked largest semiconductor equipment market in 3Q21
Worldwide semiconductor equipment billings increased 8% sequentially and a robust 38% on year to US$26.8 billion in the third quarter of 2021, according to SEMI. The quarter also...
Friday 3 December 2021
MTS maker Ko Ja sees strong demand for commercial, gaming notebooks in 2022
Demand for notebooks, particularly business and gaming models, will remain robust in 2022, and the overall notebook market is expected to register a slight growth, according to Ko...
Friday 3 December 2021
ASE obtains major orders for new Qualcomm mobile SoC
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...
Thursday 2 December 2021
Synaptics to deepen deployments in AIoT for digital transformation
Synaptics, optimistic about business opportunities arising from digital transformation, is stepping up efforts to expand product portfolios and strengthen deployments in AIoT solutions,...
Thursday 2 December 2021
DDI backend firms see demand for large-size panels pick up
Display driver IC (DDI) backend specialists including ChipMOS Technologies and Chipbond Technology have seen demand for large-size panels pick up since the fourth quarter of 2021,...
Thursday 2 December 2021
US, Japan wooing semiconductor investors; Korean car battery suppliers expanding production in Europe
To prevent national security being affected by the semiconductor demand/supply imbalance, countries around the world are offering strong incentives to attract major semiconductor...
Thursday 2 December 2021
Micron, UMC partner to strengthen supply chains
Micron Technology has announced an expansion of its business relationship with United Microelectronics (UMC), providing Micron opportunities to secure supply for automotive, mobile...
Wednesday 1 December 2021
Nichidenbo upbeat about passive component demand in 2022
Taiwan-based Nichidenbo, which distributes capacitors, MLCCs and other passive components for vendors such as Nippon Chemi-Con and Samsung Electro-Mechanics (Semco), has expressed...
Wednesday 1 December 2021
Canada reveals semiconductor roadmap 2050 action plan to build domestic IC supplies
The Canada Semiconductor Council unveiled a report with the title "Roadmap to 2050: Canada's Semiconductor Action Plan" in November, trying to come up with a strategy to address the...
Wednesday 1 December 2021
Arlitech positive about panel-use inductor shipments in 1H22
Taiwan-based inductor maker Arlitech Electronic maintains a positive outlook for its shipments for LCD display applications in the first half of 2022, when brand vendors of TV and...
Wednesday 1 December 2021
Samsung intros new logic solutions to power next-gen automobiles
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
Tuesday 30 November 2021
Niche-market PCB firm FHt to expand capacity in 2022
First Hi-tec Enterprise (FHt), a PCB maker specializing in niche-market applications, expects to have its new production capacity come online in 2022 to satisfy robust demand for...
Monday 29 November 2021
New IC fab projects to draw government subsidies in Japan
TSMC, Kioxia and Micron Technology are reportedly expected to receive government subsidies in Japan to support their new fabs or expansion projects locally in Japan.
Monday 29 November 2021
LemTech expects cooling solutions for emerging applications to boost sales
Since emerging applications such as EVs, the metaverse and low-Earth-orbit (LEO) satellites are expected boost demand for cooling, LemTech, which specializes in heat dissipation solutions,...
Friday 26 November 2021
IC test interface vendors poised to embrace booming demand for HPC chips
Peripheral backend supply chain players including makers of high-end customized IC testing sockets, wafer probe cards and burn-in boards, apart from ABF substrates, are all gearing...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.