Infineon has built a new plant in Kulim Hi-Tech Park, Malaysia, dedicated to generating 8-inch silicon carbide (SiC) wafers. Here are five major takeaways from the new facility's...
Black Sesame Technologies and Horizon Robotics, two China-based developers of smart driving chips, have recently filed for IPO on the Hong Kong Stock Exchange.
Rohm reported a declining performance over the past quarter due to sluggish sales of industrial chips and increased depreciation and research costs related to expanding production...
IC distributor WT Microelectronics (WT Micro) expects inventory adjustments for automotive and industrial ICs to persist through the end of this year, with more room for growth once...
Infineon Technologies has unveiled a new microcontroller unit (MCU) series for automotive system-on-chip (SoC) solutions, focusing on applications such as smart cockpits. This development...
Infineon Technologies AG reported revenue that missed analysts' expectations after the hoped-for resurgence in the electric vehicle market was delayed.
Qualcomm has introduced an affordable smartphone SoC tailored for India, the world's second-largest smartphone market. This move comes as more Indian consumers opt for premium phones,...
Despite achieving results at the top end of its guidance, Qualcomm anticipates stable performance in the smartphone and automotive markets, even as it expands its market share in...
Financial data from leading European and American integrated device manufacturers (IDMs) indicate that the automotive semiconductor market is underperforming, with weaker demand than...
On July 23, 2024, Infineon Technologies AG expanded its ongoing lawsuit in the U.S. District Court for the Northern District of California, adding claims against Innoscience (Zhuhai)...
Onsemi reported a decline in performance for the past quarter, attributing the downturn to short-term economic headwinds. Despite these challenges, the company remains confident in...
NIO has taped out its 5nm smart driving chip and developed SkyOS, an operating system for automotive applications, aiming to become a vertically integrated EV brand.
In March and April 2024, Intel and TSMC received substantial subsidies of US$8.5 billion and US$6.6 billion respectively for building plants in the US under the CHIPS and Science...
