The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards...
Micron Technology is advancing in the high bandwidth memory (HBM) market, historically led by South Korean giants SK Hynix and Samsung. Reports indicate that Micron has secured Nvidia's...
Surpassing Samsung in DRAM market share for the first time in its 40-year history can be attributed mainly to SK Hynix's dominance in the high bandwidth memory (HBM) market. Samsung's...
At the Google Cloud Next '25 conference, the company introduced the seventh-generation Tensor Processing Unit (TPU), Ironwood, designed for AI inference. This chip highlights Google's...
SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...
Micron Technology showcased its latest AI-optimized memory technologies at GTC 2025, unveiling advanced DRAM solutions designed for data center and high-performance computing (HPC)...
High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, just over a month after their last visit. Industry sources...
Samsung Electronics' potential collaboration with Baidu on advanced artificial intelligence (AI) chips may have been disrupted due to increased US pressure on China, according to...
Micron has appointed former TSMC chairman Mark Liu as a board member. Multiple South Korean media outlets report this move as Micron's attempt to expand its market share in high bandwidth...
The Taiwan Semiconductor Research Institute (TSRI), under the National Science and Technology Council (NSTC), announced at a press conference held by Taiwan's National Applied Research...
The global AI boom is set to keep high bandwidth memory (HBM) in short supply through 2025, as demand surges across AI and data-intensive applications, according to experts at SEMICON...
According to a report by Nikkei, Tongfu Microelectronics is rumored to have commenced trial production of high bandwidth memory (HBM2). This development follows fellow Chinese...
The HDMI Forum introduced the HDMI 2.2 specification at CES 2025, a major upgrade designed to expand the capabilities of the HDMI ecosystem. This new standard provides content creators...
The US Department of Commerce's Bureau of Industry and Security (BIS) has expanded semiconductor export controls to include high bandwidth memory (HBM), a crucial component for artificial...
