At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...

Micron Technology has disclosed plans for its Taiwan facility to become the hub of advanced packaging for high bandwidth memory (HBM).

China is keen on attaining self-sufficiency in high bandwidth memory (HBM), with ChangXin Memory Technologies (CXMT) to be playing a leading role in the development of HBM, according...

Accton Technology is working with customers to develop network switches that can effectively meet the network transmission speed and adaptability needs of next-generation data centers...

The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.

Micron Technology has announced sample availability of its CZ120 memory expansion modules to customers and partners.

DDR5 memory has recently shown a modest increase, indicating that the market price is about to enter the stage of recovering from its lowest point, according to industry sources.

Due to the bandwidth limitations of DDR SDRAM in high-speed computation, high bandwidth memory (HBM) is rapidly gaining popularity as a means to circumvent memory transmission speed...

Micron Technology announced the volume production availability of high-capacity 96GB DDR5 RDIMMs that operate at speeds of up to 4800MT/s and have twice the bandwidth of DDR4 memor...

Micron Technology has introduced the Crucial Pro series, which consists of memory and storage products designed for gamers, content creators, workstation professionals, and anyone...

Ayar Labs has completed Series C1 funding, raising an additional US$25 million to bring its total Series C funding to US$155 million, according to the US-based silicon photonics chip...

Samsung Electronics has developed what the company claims is the industry's first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Intel and Samsung collaborated...

Marvell Technology has demonstrated high-speed, ultra-high bandwidth silicon interconnects manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer (3nm)...

The emergence of generative AI technologies, such as ChatGPT, may assist the DRAM market in recovering from its slump sooner than expected, according to industry sources.

Major memory suppliers Samsung Electronics and SK Hynix reportedly are gearing up to develop CXL (compute express link)-based memory solutions, and the integration of CXL technology...