To sustain their leaderships in the global memory market, South Korean memory makers have to step up the development of new-generation memory technology and memory-based logic chips,...

Enterprise SSD and other storage device demand is expected to pick up as early as the second quarter of 2023, according to industry sources.

SK Hynix has developed working samples of DDR5 multiplexer combined ranks (MCR) dual in-line memory module, which the memory chipmaker claims is the world's fastest server DRAM pro...

Nvidia is expected to advance the rollout of a downgraded version of its AI chips, dubbed AI 800, for shipments to Chinese clients in response to restrictions on its China-bound sales...

China's top cloud service provider Alibaba Cloud (AliCloud) has recently announced that its self-developed cloud-native processor Yitian 710 has entered large-scale commercial applications...

SK Hynix has announced its DRAM and CXL solutions have been validated with AMD's just-unveiled EPYC 9004 series processors.

Global NAND flash makers are on track to start a new round of competition in producing 3D NAND chips with over 200 layers after Micron Technology announced commercial production of...

Taiwan's suppliers of optical communications devices including Browave, EZconn, APAC Opto Electronics and Apogee Optocom have all posted impressive revenue and profit gains for the...

Micron Technology has kicked off volume production of what the company claims is the world's first 232-layer NAND flash memory.

The transition to DDR5 memory in the data center sector will be taking place in 2022, and Micron Technology is gearing up for the robust demand, according to Sumit Sadana, executive...

Nvidia has recently completed its performance evaluation of SK Hynix's HBM3 samples, according to the memory chipmaker. SK Hynix will provide HBM3 for Nvidia systems expected to ship...

System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's...

Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...

While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...

The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects,...