Silicon Labs, a US-based wireless SoC and MCU provider, continues to work closely with its Taiwan-based foundry and OSAT partners to improve its delivery lead times, according to...
TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Micron Technology has announced the volume production of its new 16Gb GDDR6X memory, which is now shipping in the Nvidia GeForce RTX 3090 Ti graphics card.
Ayar Labs has announced it is partnering with Lumentum, the largest manufacturer of optical and photonics products, to deliver CW-WDM MSA compliant external laser sources in high...
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Nanya Technology plans to break ground for a new DRAM plant in the first half of 2022 in an effort to meet growing market demand, and expects to invest a total of NT$300 billion (US$10.86...
The government in Taiwan is expected to issue operating licenses for 5G private networks to qualified enterprise applicants in 2022, and related players are stepping up preparations...
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
Looming metaverse applications are expected to generate massive data drastically triggering storage demand, which will generate new business opportunities for memory vendors and backend...
MediaTek has validated Micron Technology's low-power double data rate 5X (LPDDR5X) DRAM for MediaTek's new Dimensity 9000 flagship chipset for 5G smartphones, according to Micron.
AMD and MediaTek have jointly announced a collaboration to co-engineer industry-leading Wi-Fi solutions, starting with the AMD RZ600 series Wi-Fi 6E modules containing MediaTek's...
Taiwan-based IC substrate suppliers, such as Unimicron Technology, have reportedly cut into the supply chain for Apple's custom-built silicon powering the next generation Macs, and...
TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...
Global Unichip Corp. (GUC), the advanced ASIC leader, disclosed that its second-generation GLink 2.0 (GUC multi-die interLink) interface, using TSMC 5nm process and TSMC advanced...
