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Monday 7 October 2024
Samsung's HBM3E reportedly clears Nvidia's on-site inspection; mass production still pending
Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply,...
Monday 30 September 2024
HBM oversupply looms as Samsung seeks Nvidia validation for HBM3E
Recent debates in the semiconductor industry have raised concerns about a potential oversupply of high bandwidth memory (HBM). Analysts believe a key factor will be whether Samsung...
Monday 9 September 2024
Samsung and SK Hynix vie for HBM dominance as both advance 16-layer technology
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
Friday 6 September 2024
Power consumption is main issue for AI development, says SK Hynix president Justin Kim
SEMICON Taiwan 2024 made its grand debut on the 4th. President of SK Hynix, Justin Kim, was invited to Taiwan and gave a keynote speech. He mentioned that to push AI technology towards...
Thursday 5 September 2024
Samsung and SK Hynix act on HBM4 for significant AI potential
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
Wednesday 4 September 2024
TSMC, other Taiwan firms form alliance to advance SiPh
Silicon photonics technology has become a focal point for the semiconductor industry amid the push for generative AI and high-performance computing (HPC), and TSMC has taken the lead...
Friday 16 August 2024
SK Hynix expands HBM supply to automotive applications beyond servers
SK Hynix has supplied high bandwidth memory (HBM) to Waymo, the autonomous vehicle subsidiary of Google. As the autonomous driving era dawns, HBM is expected to find widespread applications...
Wednesday 7 August 2024
CXMT's initial HBM capacity in Hefei reaches one-third of Korean manufacturers
Reports indicate that China's DRAM leader ChangXin Memory Technologies (CXMT) is actively investing in high bandwidth memory (HBM) production capacity. Currently, CXMT is establishing...
Wednesday 31 July 2024
Micron starts shipping 9th-gen TLC NAND in SSDs
Micron Technology has announced that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone.
Monday 29 July 2024
Samsung invests in AI chip startups DreamBig and Axelera AI
Samsung Electronics is ramping up investment efforts in AI chip startups to strengthen its competitiveness in new-generation AI semiconductor technologies.
Monday 29 July 2024
Nio unveils 5nm smart-driving chip, SkyOS, AI agent, and AI phone
NIO has taped out its 5nm smart driving chip and developed SkyOS, an operating system for automotive applications, aiming to become a vertically integrated EV brand.
Friday 26 July 2024
SK Hynix not concerned about HBM oversupply; optimistic that 2024 shipments will double
Benefiting from its High Bandwidth Memory (HBM) business, SK Hynix has experienced substantial revenue growth and forecasts a doubling of shipments in 2024. Regarding recent concerns...
Wednesday 24 July 2024
Samsung HBM3 and HBM3E still pending Nvidia quality tests
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
Friday 19 July 2024
Micron sampling MRDIMMs for AI and HPC
Micron Technology has disclosed that it is currently conducting sampling of its Multiplexed Rank Dual Inline Memory Modules (MRDIMM) for memory-intensive applications, including AI...
Tuesday 16 July 2024
Samsung and SK Hynix stack LPDDR DRAMs to cut AI power consumption
South Korean memory giants Samsung Electronics and SK Hynix, in addition to High Bandwidth Memory (HBM), will also start the competition in smartphone LPDDR DRAM stacking.