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Monday 10 March 2025
MWC25: Taiwan Pavilion draws global attention with 5G-6G innovations
Taiwan's delegation, led by its national team, brought 12 local companies to the 2025 Mobile World Congress (MWC), securing a prime exhibition space that significantly boosted visibility...
Wednesday 5 March 2025
Chunghwa Telecom and Nokia sign MOU to advance 6G commercialization
Chunghwa Telecom plans to commercialize 6G by 2030 and is preparing by signing a memorandum with Nokia. They will explore 5G Advanced, 6G, and AI technologies to enhance services...
Wednesday 5 March 2025
MWC Live: Kyocera and Taiwanese partners launch O-RAN alliance to disrupt 5G dominance
Top Japanese electronics manufacturer Kyocera has officially entered the 5G base station market. At MWC 2025, the company unveiled the O-RU Alliance, a partnership with telecom equipment...
Monday 28 October 2024
Taiwan launches first domestically-made high-altitude balloon to boost communication resilience
Taiwan's Ministry of Digital Affairs (MODA) launched the first test of a domestically-made high altitude platform station(HAPS) in Taitung, aiming to bolster the island's communication...
Tuesday 30 July 2024
5G remote collaboration for smart manufacturing pivotal as EMS production migrates out of China
Taiwan's Ministry of Digital Affairs (MODA) is promoting the application of 5G private networks to increase the competitiveness of all industries by combining 5G with semiconductor...
Thursday 22 February 2024
SKT, MediaTek, Nota AI's data transmission breakthrough promises phone battery for days
South Korean SK Telecom (SKT), MediaTek, and Nota AI want to keep your phone charged for longer.
Monday 6 November 2023
The next stage of Taiwan's space industry: spin-offs and technological expansion
Taiwan Space Agency (TASA) has announced that the global space industry is experiencing robust growth, particularly in satellite ground equipment, which has already achieved a significant...
Monday 28 August 2023
Satellite industry integration set to accelerate, promising new biz opportunities for supply chain players
The satellite industry is entering an integration phase, and customers from Europe, America, and Southeast Asia are all requesting the integration of medium- to...
Thursday 9 March 2023
Taiwan government to encourage telecom carriers to adopt more local-made equipment
The Taiwan government will push Taiwan-based telecom carriers to raise the ratio of made-in-Taiwan equipment adoption to 40% for their new 5G base station construction and will form...
Tuesday 7 February 2023
Excess 4G handset chip inventories hit foundries
Excess 4G handset chip inventories, including application processors and power amplifiers (PA), are dragging down fab utilization rates at related foundries, according to industry...
Thursday 28 July 2022
Epi-wafer vendor LandMark expects sales growth in 3Q22
Taiwan-based LandMark Optoelectronics, dedicated to manufacturing GaAS and InP-based epi-wafer chips for optical communications, consumer and industrial applications, expects to post...
Thursday 14 July 2022
Optical communication device makers to see datacenter apps buoy 2H22 shipments
Most of Taiwan's optical communication devices makers focusing more on datacenter than 5G base station applications have reported significant revenue improvements for the first half...
Tuesday 24 May 2022
MediaTek hires former HiSilicon executive
MediaTek has hired a former HiSilicon executive director to enhance its capability of developing high performance processors (HPC), server and base station chips, and custom ASICs,...
Tuesday 19 April 2022
Inductor maker Max Echo eyeing double-digit revenue gain in 2022
Taiwan's Max Echo Technology, dedicated to producing inductors and ferrite chip beads for niche applications, is confident that its 2022 revenues will attain a double-digit growth...
Thursday 24 March 2022
China OSAT growing advanced packaging capability
Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...