Fourth-quarter 2020 smartphone AP shipments to China-based vendors amounted to 211.6 million units, up 9.9% quarter-over-quarter and 7.7% year-over-year.

Prosperity Dielectrics Company (PDC), which mainly supplies MLCCs and related ceramic powders, has utilized over 90% of production capacity with clear order visibility extended to...

Second-quarter 2020 smartphone AP shipments to China-based vendors amounted to 169.9 million units, down 20.6% year-over-year but up 25.8% quarter-over-quarter.

The year 2020 may become the watershed in the evolution of global supply chains with regionalization and demassification in high gear posing major changes to the world, and the semiconductor...

Smartphone application processor (AP) shipments to China only amounted to 135 million units in first-quarter 2020, plunging more than 30% on quarter and 12.2% on year.

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has revised upward its capex outlook this year to US$4.3 billion, up US$1.1 billion or about 34% from...

Huawei/HiSilicon will commercialize a new NB-IoT chipset, dubbed Boudica 200, by the end of 2020, which will support 3GPP R15 standards and offer lower latencies and more integrated...

Smartphone AP shipments to China-based vendors came to 197 million units, down 5.9% on year and 7.7% on quarter.

The PC and handset supply chains are being hard hit by the ongoing coronavirus outbreak, but the server sector has been almost unscathed, as the epidemic has spurred stay-at-home...

Chunghwa Precision Test Tech (CHPT) has obtained orders for test interfaces for 5G smartphone chips from the world's first-tier fabless chipmakers, and is poised to enjoy a strong...

Tsinghua Unigroup's chipmaking arm Unisoc will enforce a capital increment of CNY5 billion (US$707.44 million) to support its development of core 5G and IoT chipsets, according to...

Backend service leader ASE Technology Holding plans to set up 15 lights-out fabs by the end of 2020 as part of its efforts to strengthen smart production capability to support high-end...

Taiwan-based backend houses including KYEC and Chipbond expect to see stable growth in demand for baseband chips and LCD driver ICs for Apple iPhone.

Samsung Electronics has taken a two-pronged approach to boost sales of its products, including 5G application processors (APs), 5G baseband chips and mid-range smartphones, in China,...

IC testing specialists King Yuan Electronics (KYEC) and Sigurd Microelectronics have both posted impressive revenues for August, expecting bright prospects for the remaining months...

IC testing solution provider Chunghwa Precision Test Tech (CHPT) saw its consolidated revenues for August 2019 increase 7.4% sequentially and 16.1% on year to a record high of NT$367...

Second-quarter 2019 smartphone application processor (AP) shipments to China showed 39.1% sequential growth, higher than previously expected, buoyed by early inventory ramp-up in...

With Qualcomm aggressively offering multiple APs, baseband chips and RF front-end modules (FEMs) to tap the 5G smartphone market, its Taiwan-based backend service providers including...

High-end CCL demand from Huawei has been rising due to a major redesign of its 5G base station infrastructure, prompting Taiwan CCL makers to upgrade their CCL specs to meet the demand,...

Taiwan-based IC testing solution provider Chunghwa Precision Test Tech (CHPT) is expected to see revenue growth significantly driven by Chinese telecom operators upgrading existing...

Apple has clinched a deal to acquire Intel's smartphone baseband (modem) chip business unit, and the US vendor is also expected to roll out MacBook models featuring its own ARM-based...

Flexible PCB specialist Flexium Interconnect is looking to explore more application opportunities for its products beyond handsets, especially those for use in 5G and IoT devices,...

TMY Technology (TMYTek), founded in 2014 to develop active and passive mmWave components, has just launched 5G beamforming technology solutions that can help address problems encountered...

MediaTek showcased at the China Mobile Global Partner Conference in Guangzhou on December 6 its first 5G baseband chipset Helio M70, which was launched in mid 2018.

Eight-inch fab capacity remains tight, whereas there is an excess of 12-inch fab capacity, according to SC Chien, co-president for pure-play foundry United Microelectronics (UMC).