Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics are all moving to expand their capacities for vapor chambers (VCs) to cash in...
Taiwan's cooling module suppliers are set for robust growth in 2020 and beyond driven by demand for heatpipe- or vapor chamber (VC)-based heat dissipation solutions from the smartphone...
With rising heat dissipation demand from major vendors including Samsung Electronics, LG Electronics, Huawei, Oppo and Xiaomi for their 5G smartphones, half of cooling module shipments...
With the public cloud continuing expanding its presence in the cloud computing market, a few players including HPE and Chaun-Choung Technology (CCI) have been pushing new products...
Taiwan-based cooling module maker Chaun-Choung Technology (CCI) is poised to tap into the segment of heatsink solutions for electric vehicles and self-driving cars through Japan's...
Taiwan-based Auras Technology has Korea and China smartphone vendors among its clients for cooling modules and will move to expand production of heat spreaders seen to be increasingly...
Cooling module maker Chaun-Choung Technology (CCI) has disclosed that Japan-based Nidec is planning to acquire up to a 48% stake in the company through a tender offer at NT$108 (US$3.50)...
Cooling module makers including Auras Technology, Chaun-Choung Technology (CCI) and Taisol Electronics have seen demand from the server sector accelerate since the beginning of second-half...
While preparing to launch 5G-enabled smartphones in the first half of 2019, most major handset vendors are reportedly seeking new thermal management solutions in response to heat...
Cooling module maker Chaun-Choung Technology (CCI) expects its products for servers and notebooks to enjoy strong demand in the second half because of seasonality. Second-half revenues...
Heat-sink pipe and thermal module maker Chaun-Choung Technology has increased yield rates for all product lines to more than 90% by using automation equipment, the company said at...
While notebook ODMs, such as Quanta Computer and Compal Electronics, have been expanding staff specifically for servers used in cloud computing data centers, their component suppliers,...
With notebook vendors becoming more aggressive in releasing low-price notebooks and leaning toward adopting cheaper components for these devices, components makers have started taking...
Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness...
