Major China-based IC foundries are already in talks with ASML about the installation of their first extreme ultraviolet (EUV) lithography equipment for the manufacture of 7nm chips,...
Global foundries will hold a "topping out" ceremony to celebrate a major milestone of the construction of its new 12-inch wafer plant in Chengdu, China at the end of October, according...
Globalfoundries' fully-depleted silicon-on-insulator FD-SOI process technology targeted at Internet of Things (IoT), artificial intelligence (AI) and Big Data applications has started...
Globalfoundries and VeriSilicon have announced a collaboration to deliver a single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF's 22FDX...
The semiconductor industry will enter a golden age in the next decade, driven by robust chip and memory demand for ultra-large data centers and artificial intelligence (AI) applications,...
Globalfoundries and the Chengdu municipality have announced an investment to spur innovation in China's semiconductor industry. The partners plan to build a FD-SOI ecosystem including...
Globalfoundries' plan to construct a new 300mm wafer fab in Chengdu, China to satisfy demand for the foundry's 22FDX technology is well on track, with production at the facility set...
China-based Chengdu HiWafer Semiconductor has commenced operation at its 6-inch GaAs chip fab, which in return will help China reduce its reliance on imports of high-end frequency...
Notebook ODM Compal Electronics will gradually move notebook production capacity at its factory in Chengdu City, western China, to its factory in Kunshan, eastern China, and has notified...
Rumors have spread in the IT market that Wistron is planning to stop its notebook production in Kunshan, China and will move all its production capacity to plants in Chongqing and...
Notebook supply chain players have recently started considering a return to their original production hubs in coastal cities of Southeastern China such as Kunshan since the Chongqing...
Texas Instruments has announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu...
Inventec had December consolidated revenues of NT$45.049 billion (US$1.50 billion) increasing 0.99% on month and 23.92% on year, while fellow maker Wistron has reported NT$48.242...
Facing strong pressure from rising labor costs in China, notebook ODMs will accelerate their pace in shifting production to inland China in 2013 with Compal set to move all its notebook...
