HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Taiwan's major dedicated IC testing house King Yuan Electronics (KYEC) has been ordered by the Central Epidemic Command Center (CECC) to have all its migrant workers undergo a 14-day...
Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding...
Logic IC backend specialist Greatek Electronics is constructing two new factories, which are set to be completed for commercial runs in 2022, but the company has already seen clients...
TSMC and other major high-tech firms in Taiwan have reported little impact from a five-hour rolling power blackout that affected many parts of the country on May 13.
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Display driver IC (DDI) backend specialists Chipbond Technology and ChipMOS Technologies have seen unstable capacity utilization for processing small- to medium-size applications...
OSATs have been notified by their Japan-based packaging materials suppliers including Showa Denko about a potential supply shortfall of as much as 50% between May and June, according...
Backend house ChipMOS Technologies will expand production capacity for memory chips by 30-40% in 2021 to meet strong demand from major memory module makers in Taiwan, according to...
Persistently strong demand for MOSFET chips and niche-type DRAM have kept backend specialists including Walton Advanced Engineering, ChipMos Technologies and GEM Services running...
Semiconductor materials distributors are expected to gain profit momentum from brisk sales of COG or COF packaging materials driven by robust demand for e-paper and ESL (electronic...
