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NEWS TAGGED CHIPMOS
Thursday 22 July 2021
HiSilicon faces difficulty gaining manufacturing support for OLED DDI
HiSilicon is gearing up in-house development of OLED display driver chips (DDI), but has encountered difficulty in gaining sufficient support from foundries and OSATs capable of providing...
Friday 16 July 2021
ChipMOS, Chipbond may further raise backend quotes in 2H21
Backend houses ChipMOS Technologies and Chipbond Technology are expected to raise again their backend service quotes later in the second half of 2021, as robust demand for car-use...
Monday 5 July 2021
OSATs see significant surge in 2H21 memory backend demand
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Tuesday 15 June 2021
DDI backend services, materials see order visibility throughout 2021
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Monday 7 June 2021
Taiwan backend houses caught in cluster COVID infections
Taiwan's major dedicated IC testing house King Yuan Electronics (KYEC) has been ordered by the Central Epidemic Command Center (CECC) to have all its migrant workers undergo a 14-day...
Monday 24 May 2021
OSATs may further hike service quotes in 3Q21
Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding...
Wednesday 19 May 2021
Greatek building new backend processing plants
Logic IC backend specialist Greatek Electronics is constructing two new factories, which are set to be completed for commercial runs in 2022, but the company has already seen clients...
Friday 14 May 2021
TSMC, high-tech firms unscathed by massive outage in Taiwan
TSMC and other major high-tech firms in Taiwan have reported little impact from a five-hour rolling power blackout that affected many parts of the country on May 13.
Thursday 13 May 2021
DDI packaging materials demand stays robust
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Wednesday 12 May 2021
Taiwan OSATs see order preparation times extended
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Wednesday 5 May 2021
Driver IC backend capacity utilization unstable
Display driver IC (DDI) backend specialists Chipbond Technology and ChipMOS Technologies have seen unstable capacity utilization for processing small- to medium-size applications...
Tuesday 4 May 2021
OSATs face increasingly tight supply of packaging materials
OSATs have been notified by their Japan-based packaging materials suppliers including Showa Denko about a potential supply shortfall of as much as 50% between May and June, according...
Thursday 22 April 2021
ChipMOS to expand backend capacity for memory chips
Backend house ChipMOS Technologies will expand production capacity for memory chips by 30-40% in 2021 to meet strong demand from major memory module makers in Taiwan, according to...
Monday 12 April 2021
Backend demand stays strong for MOSFETs, niche DRAMs
Persistently strong demand for MOSFET chips and niche-type DRAM have kept backend specialists including Walton Advanced Engineering, ChipMos Technologies and GEM Services running...
Monday 22 March 2021
IC materials distributors buoyed by strong e-paper DDI demand
Semiconductor materials distributors are expected to gain profit momentum from brisk sales of COG or COF packaging materials driven by robust demand for e-paper and ESL (electronic...