The supply of 8-inch wafer fabrication services remains tight, due to robust demand for fingerprint-on-display (FoD) solutions, CMOS image sensors and power management ICs, according...

Taiwan-based handset display driver IC backend specialists have seen customer orders slow down, with poor order visibility for the next several months, but they expect demand to rebound...

Taiwan-based backend houses including Powertech Technology (PTI) and ChipMOS Technologies are expected to enjoy stable demand coming from the memory sector in 2020, thanks to brisk...

Taiwan-based display driver IC designers and backend specialists are looking to ready additional capacities by mid-2020 to meet growing demand for OLED driver ICs, according to industry...

As shipments of midrange 5G smartphones are expected to expand significantly in 2020, the resultant strong demand for chipsets will be a major revenue growth driver for Taiwan's backend...

Memory module manufacturers and backend service providers have seen end-market demand pick up recently, and are gearing up to meet 5G-driven demand with their sufficient supplies...

Backend house ChipMOS Technologies expects to post revenue growth sequentially in the fourth quarter of 2019, driven mainly by growing demand for flash memory chips.

Global shipments of TWS (true wireless stereo) earphones are expected to surge sharply to 150-200 million sets in 2020 from around 100 million sets estimated for 2019, providing strong...

Backend demand for OLED driver ICs is set to take off in 2020, with COP (chip on plastic) and COF (chip on film) likely to co-exist as main packaging processes, according to industry...

Taiwan's COF (chip on film) supply chain is poised to embrace a prosperous year in 2020, as new COF solutions are expected to be massively applied to integrate optical in-display...

NAND and NOR flash demand for TWS devices, gaming consoles and smartphones has been rising along with the approaching of traditional shopping seasons, providing significant growth...

Aggregate home-bound investments by Taiwanese firms operating in China have soared past NT$600 billion (US$19.33 billion) following the government approval of a NT$15.1 billion investment...

Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...

COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may...

As super-slim in-display optical fingerprint sensor chips will see increasing penetration in 5G smartphones, Taiwan's IC backend service firms including ASE Technology Holding, ChipMos...

With 5G business opportunities starting to emerge, CCL makers have been keenly increasing their capacity to satisfy...

Taiwan-based memory modules packagers Orient Semiconductor Electronics (OSE) and ChipMos Technologies are expected to see their revenues pick up month by month in the second half...

A ramp-up in orders for NAND flash memory will boost revenues at backend houses ChipMOS Technologies and Orient Semiconductor Electronics (OSE) in the second half of 2019, according...

Chip-on-film (COF) substrate supplier JMC Electronics has enjoyed robust demand for semi-additive tape COF packaging services, boasting clear order visibility through the first half...

Backend house ChipMOS Technologies expects a pick-up in demand for DRAM in the second half of 2019, while new orders for NAND flash devices will start generating revenues.

Taiwan-based memory backend specialists have seen clear order visibility through the fourth quarter of 2019, as they have directly or indirectly tapped into the supply chains of major...

Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end...

Taiwan-based backend houses and COF substrate suppliers will see orders from Huawei pick up in July or August, according to industry sources.

Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...

Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...