On February 26, Nvidia released its financial results for the fourth quarter of fiscal year 2025 (February 2024 to January 2025), showcasing remarkable growth across all key metrics...
Chinese smartphone application processors (APs) shipments are expected to remain stable in the first quarter of 2025 despite the traditional off-season, supported by China's handset...
A report by the German Trade Office Taipei highlights that TSMC's fab construction in Dresden is enhancing Taiwan's profile and boosting collaboration with Germany. Taiwanese companies...
Taiwan and the Netherlands have maintained a close long-term partnership in the semiconductor industry. To accelerate the development of silicon photonics (SiPh) technology, the International...
In addition to its ongoing commitment to the automotive industry, Tsang Yow has reportedly set its sights on the high-growth semiconductor sector. The company stated that to meet...
The Trump administration has reportedly urged TSMC to partner with Intel and expedite its investments in the US. Sources suggest that TSMC is weighing a controlling stake in Intel's...
Donald Trump, President of the United States, has repeatedly signaled potential tariff increases on semiconductors and possible adjustments to the CHIPS Act subsidies, intensifying...
China's aggressive price war in mature-node wafer manufacturing appears to be stabilizing, as Vanguard International Semiconductor (VIS) reports shifting customer orders. Chairman...
According to the official press release Micron Technology announced the shipment of samples of its 1γ, sixth-generation (10nm-class) DRAM-based DDR5 memory to ecosystem partners...
Shih-Jye Cheng, chairman of ChipMOS, a leading memory packaging and testing company, announced that the company's first-quarter revenue is expected to experience modest declines,...
STMicroelectronics (STMicro), a Franco-Italian chipmaking joint venture, is navigating significant pressures due to a downturn in key markets and internal performance concerns.
South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND...
Fueled by the surging demand for CMOS Image Sensor (CIS) components in intelligent driving systems and consumer electronics, Will Semiconductor (WillSemi), the company behind OmniVision,...
