The increasing adoption of application-specific integrated circuits (ASICs) for artificial intelligence (AI) has sparked discussions about potential competition to Nvidia's GPU market...
Apple is ramping up efforts to develop its own wireless connectivity chips, signaling a shift away from suppliers. The company is advancing in modem, Wi-Fi, and RF chip development,...
Nikon plans to introduce a new ArF immersion lithography system platform in fiscal year 2028 (April 2028 - March 2029) that offers compatibility with ASML equipment, marking a strategic...
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
In the latter half of 2024, global demand for silicon wafers began to rebound from the industry's downturn experienced in 2023, as reported by the SEMI Silicon Manufacturers Group...
China recently unveiled a series of subsidy policies targeting consumer electronics and home appliances to stimulate domestic consumption. Beyond the central government's efforts,...
Amid intensifying competition in the mature-node segment, Hua Hong Semiconductor is pivoting toward higher-value process technologies. The company posted a fourth quarter of 2024...
Recent market rumors suggest that Arm is entering the chip development battleground, with Meta's cloud computing chip as its first product. Many are concerned that this indicates...
The global market is watching how TSMC, pressured by the US, might assist Intel's foundry operations, while Samsung Electronics and Rapidus, also facing challenges, may similarly...
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth...
Despite aspirations to become a comprehensive semiconductor powerhouse, South Korea's global semiconductor market share remains at a mere 3%. The government is launching a major initiative...
Samsung Electronics' semiconductor head Young-Hyun Jun reportedly met with Nvidia CEO Jensen Huang in the US, fueling speculation that Samsung is advancing its bid to supply HBM3E...
SK Hynix has reportedly appointed Vice President Woong-sun (William) Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched...
While many major players in the communications supply chain have scaled back investments in satellite technology, MediaTek continues to push forward. The company consistently showcases...
According to Infineon's press release, the company is advancing its 8-inch silicon carbide (SiC) technology, having released its first products in the first quarter of 2025. These...
