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Tuesday 3 December 2024
Five crises facing Intel amid CEO departure; board rumored to consider former TSMC executive for top role
Intel's CEO Pat Gelsinger has announced his retirement, effective December 1, amid the company's struggles with design and manufacturing separation and ongoing financial losses. In...
Tuesday 3 December 2024
iCatch Technology launches imaging ASIC services for automotive, military, and industrial markets
Egis Technology's subsidiary iCatch Technology has announced its strategic transformation, with Chairman S.C. Lo highlighting the company's solid foundation in image signal processor...
Tuesday 3 December 2024
Airoha secures R&D funding, challenges Qualcomm with Bluetooth audio chips
According to Taiwan's Ministry of Economic Affairs, MediaTek subsidiary Airoha has secured NT$140 million (US$4.3 million) in R&D subsidies through the ministry's A+ Industrial...
Tuesday 3 December 2024
Denso, Fuji Electric secure METI subsidy for SiC chip mass production
Japan's Ministry of Economy, Trade, and Industry (METI) has announced a subsidy program totaling up to JPY70.5 billion (US$470.34 million) for the SiC power semiconductor production...
Tuesday 3 December 2024
Trump 2.0 looms: Indian manufacturing draws chip distributors
Global supply chains have gradually diversified in recent years, with India emerging as a potential replacement for China in the electronics manufacturing sector. As geopolitical...
Tuesday 3 December 2024
Nvidia and Tesla set to challenge IDMs' dominance in industrial robotics
Both Tesla CEO Elon Musk and Nvidia CEO Jensen Huang consider humanoid robots to be the ultimate chapter in AI development. According to a Goldman Sachs research forecast for the...
Monday 2 December 2024
Intel announces departure of CEO Pat Gelsinger
Intel CEO Pat Gelsinger has retired from the company following a distinguished 40-plus-year career and has resigned from the board of directors, effective December 1, 2024.
Monday 2 December 2024
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
Monday 2 December 2024
United, we thrive: Mitsubishi Electric aims to restructure Japan's power semiconductor sector
Mitsubishi Electric President and CEO, Kei Uruma, revealed in a Tokyo interview that the company is pursuing a restructuring initiative within Japan's power semiconductor sector,...
Monday 2 December 2024
Murata cements MLCC market supremacy with focus on AI, smartphones, and wearables
Murata Manufacturing Co. has unveiled a new mid-term business plan focused on boosting market share for its flagship product, Multi-layer Ceramic Capacitors (MLCCs), in response to...
Monday 2 December 2024
DeepX AI chip achieves up to 90% yield with Samsung's 5nm process
South Korean AI chip startup DeepX is in the final stages of preparation for its first mass-produced chips. Through Samsung Electronics' foundry division, the company has achieved...
Monday 2 December 2024
Samsung slashes photoresist usage in 3D NAND production, impacts supplier
Samsung Electronics has reportedly reduced its use of thick photoresist (PR) in the photolithography process for its latest 3D NAND flash, achieving significant cost savings. This...
Monday 2 December 2024
Jamicon Teapo pins 2025 growth hopes on AI amid market headwinds
Faced with challenging market conditions, Jamicon Teapo is repositioning its 2025 growth strategy to focus on AI applications, particularly in high-end passive components and high-ASP...
Monday 2 December 2024
Weekly news roundup: SMIC leads China's semiconductor rise as memory makers gain ground
Semiconductor Week in Review (Nov 24 - 30) :
Monday 2 December 2024
Taiwan weighs overseas science parks to tackle talent and resource challenges
Amid mounting pressures on talent and resources, Taiwan is looking to widen its horizons abroad, exploring the possibility of establishing science parks beyond its borders as part...