CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Wednesday 30 October 2024
Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
Wednesday 30 October 2024
China pushing domestically developed AI chips and deployment of RISC-V structure, says DIGITIMES Research
DIGITIMES Research observes that China is rapidly advancing in the field of LLMs. Major technology giants such as Baidu, Alibaba, and Tencent have launched their self-developed LLMs...
Wednesday 30 October 2024
Trump and Vance sing a different tune on Taiwan chips ahead of US election
As the US presidential election approaches, Republican candidate Donald Trump and running mate JD Vance have expressed markedly different views on Taiwan's semiconductor industry,...
Wednesday 30 October 2024
Infineon unveils ultra-thin 20-micrometer power semiconductor wafer
Infineon Technologies has disclosed its latest milestone in semiconductor manufacturing technology, following the announcement of the world's first 300-millimeter GaN power wafer...
Wednesday 30 October 2024
Samsung set to introduce high-NA EUV equipment by early 2025
Samsung Electronics is reportedly preparing to introduce its first High-NA EUV (extreme ultraviolet lithography) equipment in early 2025, signaling a major advancement for the South...
Wednesday 30 October 2024
Samsung enters the SiPh race with I-Cube So/Eo, challenging TSMC and China's rising stars
Samsung Electronics and TSMC are ramping up the development of SiPh technology to handle the exponential data growth driven by AI applications. The Seoul Economic Daily reports...
Wednesday 30 October 2024
Glass substrates poised to transform advanced packaging: Q&A with Corning commercial technology director Xavier Lafosse
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping,...
Wednesday 30 October 2024
Nikon to enter back-end semiconductor exposure equipment market with photomask-free technology
Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach,...
Wednesday 30 October 2024
Hon Precision secures orders from top US CSPs, riding the CoWoS growth wave
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
Wednesday 30 October 2024
Macronix chairman doubts 2025 demand recovery but better than 2024
Macronix International, a mask ROM and flash memory chipmaker, expects its operations to improve in 2025 compared to this year, but demand will not fully recover, according to company...
Wednesday 30 October 2024
TSMC faces the localization test amid globalization's waning influence
On October 26th, the TSMC "family" gathered for its annual sports day, with founder Morris Chang calling it his favorite day of the year. Hosting for the first time, Chairman C.C...
Wednesday 30 October 2024
OpenAI, Broadcom working to develop AI inference chip
OpenAI is working with Broadcom Inc. to develop a new artificial intelligence chip specifically focused on running AI models after they've been trained, according to two people familiar...
Wednesday 30 October 2024
Nuvoton advances edge AI and IoT with NuEzAI platform, targets 2025 growth
The edge AI market continues its upward trajectory, with microcontroller (MCU) maker Nuvoton Technology capitalizing on new opportunities through AI and green energy sectors.
Wednesday 30 October 2024
Qualcomm-Arm dispute threatens supply chain stability
Arm has stated that it is adequately prepared for the court hearing scheduled for December, as the dispute between Qualcomm and Arm continues to develop. In response, Qualcomm maintains...
Wednesday 30 October 2024
CIS packaging firm Tong Hsing projects seasonal decline in 4Q24, cautious growth outlook for 2025
The semiconductor packaging specialist and Yaego Group affiliate Tong Hsing Electronics reported that seasonal patterns in 2024 have differed from previous years, with revenue remaining...