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Friday 25 October 2024
Micron PCIe Gen5 SSDs earn spot on Nvidia GB200 NVL72 vendor list
Micron Technology has announced that its 9550 PCIe Gen5 E1.S data center SSDs have been qualified for Nvidia's recommended vendor list (RVL) for the NVIDIA GB200 NVL72 system and...
Friday 25 October 2024
Tongtai expands semiconductor presence with PCB, FOPLP solutions
Tongtai Machine & Tool is intensifying its expansion into the semiconductor sector, targeting automotive, aerospace, medical, and electronic semiconductors. The company forecasts...
Friday 25 October 2024
Kioxia and Nanya join forces to develop next-gen DRAM
Japanese NAND flash leader Kioxia has partnered with Taiwan's Nanya Technology to develop groundbreaking DRAM technology that reduces component size by two-thirds. This milestone...
Friday 25 October 2024
NAND flash market faces cyclical downturn amid production adjustments
The NAND flash market is currently experiencing a cyclical downturn due to persistent oversupply conditions. Key factors contributing to this situation include weakening demand from...
Friday 25 October 2024
Kioxia delays IPO amid stakeholder valuation concerns
Kioxia has postponed its IPO due to valuation concerns. Bain Capital, a major shareholder, is hesitant to proceed with the IPO at the current valuation, while Toshiba, the second-largest...
Friday 25 October 2024
Samsung reveals silicon capacitors and 3.5D packaging roadmap
Jeong Gi-tae, vice president of Samsung Electronics' foundry business unit, recently revealed the development roadmap for the company's wafer foundry technology at an industry-academic...
Friday 25 October 2024
Intel reportedly invites Samsung to form foundry alliance, aiming to catch up to TSMC
Recent reports from South Korea suggest that Intel has privately initiated discussions with Samsung Electronics to explore the possibility of forming a "foundry alliance." Both companies...
Friday 25 October 2024
PCB top players gather at TPCA 2024, eye AI-driven growth
TPCA Show 2024, Taiwan's premier PCB manufacturing event, spotlights the theme "Innovative AI in PCB," reflecting the transformative impact of generative AI technologies like ChatGPT...
Friday 25 October 2024
Win Semi upbeat about compound semiconductors for AI, satellite communication applications
Compound semiconductors are crucial in the rapid advancement of AI, data center applications, and satellite communication, according to Yu-Chi Wang, vice chairman of GaAs foundry...
Friday 25 October 2024
NEMStek lands plasma equipment orders for FOPLP
Nano Electronics and Micro System Technologies (NEMStek), a developer of plasma technologies and surface treatment solutions, has entered the supply chains of Chinese and Taiwanese...
Friday 25 October 2024
TSMC to see handset chip orders exceed NT$1 trillion in 2024
Despite a rumored drop in iPhone 16 orders, TSMC's handset chip revenue is expected to exceed NT$1 trillion (US$31 million) in 2024, according to supply chain sources.
Friday 25 October 2024
Qualcomm touts superior battery performance despite no new PC chips
Despite not announcing any new PC chips at this year's Snapdragon Summit, Qualcomm addressed performance claims made by Intel and AMD while sharing specifications for upcoming developments...
Friday 25 October 2024
TSMC to hike sub-5nm quotes in 2025; 2nm to exceed US$30,000
TSMC has made adjustments to its foundry quotations for 2025 to clients to alleviate the effects of gross margin losses caused by high operating costs in overseas facilities and 2nm...
Thursday 24 October 2024
Micron anticipates AI demand boost as EUV-based DRAM enters production in 2025
Micron Technology, which has fully allocated its HBM production capacity for calendar 2025, indicated that demand for AI will increase as it expands from cloud servers to consumer...
Thursday 24 October 2024
SK Hynix maintains edge in HBM3E, but HBM4 certification and Samsung's pursuit pose risks
SK Hynix will announce its financial results for the third quarter of 2024 on October 24. During its previous earnings call, the company indicated that shipments of its HBM3E products...