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Wednesday 16 October 2024
China's semiconductor powerhouses unite as Beijing unleashes massive stimulus push
Over the weekend of September 21, 2024, more than 300 industry leaders from renowned companies such as STMicroelectronics (STM), AMD, Huawei, SMIC, Hua Hong Semiconductor, Yangtze...
Wednesday 16 October 2024
Wolfspeed secures US$750 million funding for US SiC production expansion
Wolfspeed, a US-based silicon carbide (SiC) chipmaker, has secured up to US$750 million in federal funding to construct a new wafer plant in North Carolina and expand its New York...
Wednesday 16 October 2024
CMI bets on high-speed FPC tech, plans Thailand expansion for 2H25
CMI, the leading flexible printed circuit (FPC) board manufacturer, held its earnings call on October 15. Ming-Feng Cheng, CMI's spokesperson, announced that future product development...
Wednesday 16 October 2024
Samsung's Galaxy S25 chip race heats up: Qualcomm, MediaTek, and Exynos vie for FE series
Samsung Electronics reportedly will use third-party SoC chips for its forthcoming FE smartphone line.
Wednesday 16 October 2024
AUO dismisses speculation about FOPLP deployments
Taiwan-based LCD panel maker AU Optronics (AUO) has dismissed speculation that it is planning to establish a foothold in semiconductor packaging by developing FOPLP.
Wednesday 16 October 2024
Chinese CIS firms gain flagship smartphone market share
OmniVision and other Chinese CMOS image sensor (CIS) makers have expanded their foothold in the premium smartphone-use camera segment, mounting strong challenges for market leader...
Wednesday 16 October 2024
Unigroup Guoxin faces challenges as leadership reorganization aims to tackle constraints
Unigroup Guoxin Microelectronics (Guoxin Micro) announced on October 15 that its former chairman, Daojie Ma, has resigned and will now serve as vice chairman. Jie Chen, who is a board...
Wednesday 16 October 2024
TCB packaging crucial in AI and HPC applications, says ASMPT
Semiconductor and electronics manufacturing equipment supplier ASMPT sees sustained strong demand for thermocompression bonding (TCB) machines used in advanced packaging, as the trend...
Wednesday 16 October 2024
ASML confirms shipping third High NA EUV, remains optimistic about long-term growth despite weak 2025 outlook
ASML has announced the shipment of its third High NA lithography system to a new customer after unexpectedly releasing its financial results ahead of schedule. The company acknowledged...
Wednesday 16 October 2024
ASML's order plunge suggests Intel and Samsung pullback, potentially benefiting TSMC
ASML's latest financial results revealed that some chipmakers have slowed their investments. Analysts speculate that Intel and Samsung may be the ones cutting back, potentially easing...
Wednesday 16 October 2024
TSMC raises CoWoS output goal again, say sources
TSMC has been urging its factory engineering and equipment suppliers to expedite shipment pull-ins, enabling the contract chipmaker to raise its monthly output target for CoWoS packaging,...
Tuesday 15 October 2024
Wolfspeed to strengthen U.S. silicon carbide manufacturing with $750 million CHIPS Act investment
The Biden-Harris Administration has announced a preliminary agreement with Wolfspeed, Inc. to bolster U.S. leadership in silicon carbide manufacturing through a proposed US$750 million...
Tuesday 15 October 2024
US weighs capping exports of AI chips from Nvidia and AMD to some countries
Biden administration officials have discussed capping sales of advanced AI chips from Nvidia Corp. and other American companies on a country-specific basis, people familiar with the...
Tuesday 15 October 2024
Chinese smartphone makers gear up for October launches with new flagship Android SoCs
Following MediaTek's launch of the Dimensity 9400 platform, Vivo and Oppo are set to roll out their X200 and Find X8 models, respectively, this week. In response to Qualcomm's upcoming...
Tuesday 15 October 2024
ElevATE partners with Polar Semiconductor for advanced manufacturing
ElevATE Semiconductor and Polar Semiconductor have formed a strategic alliance to develop and produce ElevATE products used by world-class ATE equipment and semiconductor manufactu...