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NEWS TAGGED CHIPS + COMPONENTS
Tuesday 8 October 2024
Power IC demand picking up; return of international IDMs a concern
The power semiconductor market is recovering from its downturn, with demand starting to pick up, according to industry sources from China and Taiwan.

The industry generally...
Tuesday 8 October 2024
NAND flash market faces cost crunch: Samsung and SK Hynix buck the trends eyeing expansion
Despite AI-driven growth in the NAND flash market, the rising costs of technological transitions remain a major hurdle.
Tuesday 8 October 2024
Apple Vision Pro's high-cost components revealed: SK Hynix powers RI chip
Apple's mixed reality (MR) headset, the Vision Pro, is known to feature two key chips—the M2 for handling most computations and the R1 for reducing latency and processing sensor...
Tuesday 8 October 2024
Macronix on track for growth in 2H24
Macronix International, a maker of mask ROM and flash memory, is expected to resume growing in the second half of this year after experiencing a 20% sequential revenue increase in...
Tuesday 8 October 2024
Li Auto reportedly to tape out in-house developed smart driving chip by end of 2024
China-based electric vehicle (EV) vendor Li Auto reportedly will complete the tape-out of its smart driving SoC by the end of 2024, catching up with its two major domestic rivals,...
Tuesday 8 October 2024
Samsung reports weaker-than-expected 3Q24 operating profit; lags in HBM supply for Nvidia
Samsung Electronics has reported a weaker-than-expected operating profit for the third quarter of 2024, with experts attributing this shortfall to the company's lagging position in...
Tuesday 8 October 2024
Cost of new Huawei handset SoC rises
Huawei is set to launch its latest flagship smartphone powered by the rumored Kirin 9100, a commercially uncompetitive chip without government support.
Tuesday 8 October 2024
UMC sees 3Q24 revenue hit 7-quarter high
Pure-play foundry United Microelectronics (UMC) saw its third-quarter revenue climb to a 7-quarter high, thanks to consistent growth in mature process utilization.
Monday 7 October 2024
SK Hynix diversifies supply chain, challenges Hanmi's grip on HBM equipment
SK Hynix is set to diversify its supply chain for thermocompression bonding (TCB) equipment used in HBM manufacturing. The company acquired an order of 30 units of TCB machines from...
Monday 7 October 2024
Liquid cooling solutions to receive spotlight at 2024 OCP Global Summit
The AI server rack featuring Nvidia's Blackwell chip will begin mass production in the fourth quarter of 2024, which is expected to increase the percentage of liquid cooling solutions...
Monday 7 October 2024
DRAM, flash momentum slows: Memory packaging and testing bracing for a soft 4Q24
The sluggish recovery in memory end-market demand has led to an early slowdown in supply chain activity, impacting the operational growth of memory packaging and testing firms in...
Monday 7 October 2024
Samsung's strategic cost-cutting: its next move to restore global competitiveness
Samsung Electronics, facing difficulties in its wafer foundry business, has implemented cost-cutting measures, including the cancellation of on-site events and a slowdown in investment...
Monday 7 October 2024
Rapidus to build backend semiconductor manufacturing process R&D center
Rapidus has announced plans to establish a clean room at Seiko Epson's manufacturing facility in Chitose, Hokkaido, as well as a R&D center for semiconductor post-processing known...
Monday 7 October 2024
TSMC's three-pronged strategy: Outsourcing CoWoS to Amkor as US plant exceeds expectations
TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor...
Monday 7 October 2024
Samsung's HBM3E reportedly clears Nvidia's on-site inspection; mass production still pending
Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply,...