Powerchip has announced the signing of a definitive agreement with Tata Electronics in New Delhi. Under the agreement, Powerchip will assist Tata Electronics in constructing India's...
Yageo Chairman Pierre Chen boldly declared, "Yageo is no longer the company you once knew." As the leading passive component manufacturer continues its transformation, Yageo is positioning...
Intel is currently facing an unprecedented crisis and recently decided to spin off Intel Foundry (IF), hoping to revive its foundry business by adopting TSMC's "no competition with...
STMicroelectronics, while expanding production capacities in France and Italy, is also collaborating with Sanan Optoelectronics to establish a SiC fab in Chongqing, underscoring China's...
Tongfu Microelectronics and Tianshui Huatian, two major ATMP/OSAT providers in China, have announced fresh investments in their advanced packaging businesses.
Thailand is set to make a significant stride in the semiconductor industry with the establishment of its first silicon carbide (SiC) wafer factory, which is expected to begin operation...
Despite AI-driven growth in the semiconductor industry, South Korea is facing a critical shortage of skilled workers. A preference among students for medical degrees and aggressive...
At its September 19 board meeting, Taiwan's Central Bank emphasized Taiwan's critical role in maintaining its semiconductor dominance amid escalating US-China trade tensions in technology...
Rumors about Qualcomm's attempt to take over Intel have been intensifying, despite various sources suggesting that "everything is still in the early stages." The market remains highly...
The global printed circuit board (PCB) industry is experiencing significant shifts due to geopolitical factors, with many manufacturers moving production from China to Southeast Asia...
Trio Technology International Group, a Taiwan-based passive component maker, expects demand for AI and automotive device applications to drive growth in the coming years.
MediaTek has kicked off a promotional campaign for its new Dimensity 9400 mobile SoC, which will be officially unveiled on October 9, followed a week later by the launch of the Vivo...
Benefiting from the global AI boom, Tainan Science Park saw a complete recovery of its six major industries in the first half of 2024, driven primarily by the semiconductor sector...
AMD CEO Lisa Su predicts that while GPUs currently dominate AI tasks due to their parallel processing efficiency, the future will see a broader range of chip architectures emerge...
K Hynix has commenced mass production of the world's first 12-layer HBM3E product, boasting a 36GB capacity, the highest of any current HBM available, according to the memory chip...
