With 2024 widely regarded as the inaugural year for the AI PC era, Taiwanese PCB manufacturers are revving up to meet the upcoming replacement demand for AI PCs and notebooks, expected...

Nvidia's GB200 Superchips are about to be shipped. Liteon Technology has sent its AI server liquid cooling solution specifically designed for Nvidia GB200's 19-inch OCP racks for...

IC design house Egis Technology (EgisTec) has stepped up its deployment in the IP and IC design service sector, looking to capitalize on the potential of the AIoT market.

Sensor component specialist Taiwan-Asia Semiconductor (TASC) will boost its GaN and SiC component shipments in the second half of 2024, to generate more than 5% of revenue from the...

Memory prices are rising quarter after quarter, yet consumer electronics demand remains subdued. Recently, there have been rumors that Chinese memory module manufacturers are clearing...

As AI technology increasingly moves from the cloud to edge devices, the use of passive components—in particular Multilayer Ceramic Capacitors (MLCC)—will rise exponentially...

Amid the global shifts in the chip industry, Malaysia is promoting its neutrality, non-alignment, and established IC backend industry as key advantages to advance and build a more...

Micron Technology's High-Bandwidth Memory (HBM) sales will climb to several hundred million US dollars in the current fiscal year and then to several billion US dollars in the next...

Key Takeaway: Fabs located in China have been purchasing equipment at a rapid pace during the past three years leading to expanding capacity.

Nan Ya Printed Circuit Board (Nan Ya PCB), one of Taiwan's largest IC substrate suppliers, expects business will pick up in the second half of 2024, after a slow start in the first...

China's freshly launched CNY344 billion (US$47.5 billion) national chip fund is likely to prioritize investments in major semiconductor firms, supporting their development of AI computing...

China's domestic AI chipmakers are making fast progress in closing the gap on international leaders, according to SenseTime Group Inc. co-founder Xu Bing.

Chinese CPU maker Loongson Technology Founder and Chairman Hu Weiwu, who is also a Chinese Academy of Sciences Institute of Computing Technology researcher, told Xinhua News Agency...

Samsung Electronics is keenly exploring "hafnia ferroelectrics" as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers...

Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.