Samsung Electronics reportedly intends to use metal oxide resist in the Extreme Ultraviolet (EUV) exposure process of new generation DRAM products. Metal oxide resist belongs to the...
According to sources cited by the Wall Street Journal (WSJ), Apple is said to be working on a chip designed specifically for running artificial intelligence software on data...
Aiming to secure orders for Nvidia's next-generation High Bandwidth Memory (HBM) and regain its market-leading position, Samsung unprecedentedly mobilizes over 400 "semiconductor...
According to the Economic Times, Hindu Business Line, and EE News Europe, India-based Mindgrove Technologies, backed by Peak XV Partners, announced the...
To catch up with the global image sensor market leader Sony, Samsung Electronics will strengthen cooperation with Taiwan-based pure-play foundry United Microelectronic Corp. (UMC)...
Gallium Arsenide (GaAs) foundry Advanced Wireless Semiconductor Company (AWSC) has seen a surge in orders for flagship smartphone chips from manufacturers such as Qualcomm, boosting...
Taiwan-based IC design houses are generally bullish about their market prospects for the second half of 2024, notwithstanding the persistently unfavorable macroeconomic climate, according...
Strong demand for its flagship Dimensity smartphone SoC series is likely to give MediaTek promising development prospects, according to supply chain sources.
DRAM and NAND flash prices are unlikely to trend downward in the next two quarters, according to Gerry Chen, president of memory module company Team Group.
SK Hynix reportedly designated its M17 factory site as another new DRAM production base soon after announcing in late April its investment in the M15X DRAM plant in Cheongiu, South...
Winbond Electronics, a manufacturer of specialty DRAM and flash memory, sustained operating losses throughout the first quarter of 2024, including a NT$464 million (US$14.4 million)...
