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Tuesday 9 April 2024
Micron to raise DRAM and SSD prices by 25%, say sources
Multiple clients have been informed that Micron Technology intends to sequentially increase its DRAM and SSD product prices by more than 25% during the second quarter, according to...
Tuesday 9 April 2024
HPC and AI devices to boost ABF substrate demand
Despite slowing ABF substrate market growth, demand is expected to be fueled by rising demand for HPC and AI device applications.
Tuesday 9 April 2024
Advanced chips 100% made in US will be possible
According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...
Monday 8 April 2024
TSMC plans a third fab in Arizona and to receive up to US$6.6 billion in Chips Act funding
TSMC today announced that the US Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding...
Monday 8 April 2024
IC design firms may tone down forecasts amid end market rumbles
Recent news in the consumer electronics market has been cause for some concern, as the PC market in China is seeing weak demand and high inventory levels, while smartphone sales have...
Monday 8 April 2024
Memory chip vendors suspend 2Q24 contract pricing in wake of Taiwan tremor
DRAM makers have temporarily stopped offering product quotes, signaling a likelihood that there will be major increases in prices in the wake of a strong earthquake that shook Taiwan...
Monday 8 April 2024
Global semiconductor sales increase 16% in February, says SIA
According to the Semiconductor Industry Association (SIA), global semiconductor sales totaled US$46.2 billion in February 2024, up 16.3% from US$39.7 billion a year earlier.
Monday 8 April 2024
Meet the analyst: Operating system in AI era will be king, says DIGITIMES Research
In the past, it was the chip that created the user's needs, but when hardware has little room to expand for running Artificial Intelligence (AI) models while the difference between...
Monday 8 April 2024
NPU applications grow in AI era
Neural Processing Units (NPU) are being introduced into all types of SoCs to improve the performance of AI applications in the new AI era, with leading SoC manufacturers and IDMs...
Monday 8 April 2024
Samsung's advanced packaging reportedly grabs Nvidia orders amid competition with TSMC
Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging...
Monday 8 April 2024
WT Micro acquisition of Future Electronics finalized: Five key impacts you should know about
WT Microelectronics (WT Micro) announced that it has officially completed its acquisition of Future Electronics. This is the biggest M&A project in the history of Taiwan's semiconductor...
Monday 8 April 2024
SK Hynix enters investment deal for advanced chip packaging with Indiana
SK Hynix recently announced plans to invest an estimated US$3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Monday 8 April 2024
Why do quake-ridden Taiwan and Japan thrive in semiconductor industry?
After the 7.4 magnitude earthquake hit northeastern Taiwan, TSMC's speedy recovery to resume operation on the late evening of April 5 demonstrated the resilience and flexibility of...
Monday 8 April 2024
Indian server maker Mega Networks planning AI servers and OSAT plant
Mega Networks, an Indian server solutions provider with almost 28 years of experience, is planning to bring out AI servers and enter the semiconductor packaging segment.
Monday 8 April 2024
Weekly news roundup: Nikon expresses worries over rising Chinese competition in lithography
These are the most-read DIGITIMES Asia stories in the week of April 1 - April 5.