TSMC's project to build an advanced wafer fab in Arizona may be a financial pitfall, as the Taiwanese pure-play foundry keeps increasing its investment without the US government confirming...
AI chips reportedly being developed by Tesla using heterogeneous integration are driving up demand for IC verification analysis services, according to industry sources.
Automotive-grade IC prices are unlikely to drop in the short term, as production costs are rising and major European suppliers are increasing investments in expanding their manufacturing...
Market observers view TSMC's overseas expansion strategy with skepticism, which also presents some opportunities for the pure-play foundry. Despite the fact that its wholly owned...
A substantial recovery in PC demand is unlikely to take place until 2024, according to Parade Technologies, which specializes in high-speed transmission chips. Parade chairman Ji...
Samsung Electronics' semiconductor foundry business unit and design solution partner (DSP) CoAsia reportedly have signed a contract with Germany's IC design house Inova Semiconductors...
Renesas Electronics and Sequans Communications, a provider of 5G/4G cellular IoT chips and modules, have signed a memorandum of understanding whereby Renesas will acquire Sequans...
TSMC has announced that it will invest alongside Robert Bosch, Infineon Technologies, and NXP Semiconductors in European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany...
IC design house Realtek Semiconductor is cautious about its sales prospects for the second half of this year, despite experiencing a substantial increase in revenue during the second...
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
Chinese foundries including CanSemi Technology, GTA Semiconductor, and Nexchip Semiconductor have stepped up enhancing their mature-node manufacturing capability for automotive ICs,...
Over the past two weeks, Reuters and Nikkei Asia have closely monitored the rumors surrounding a potential collaboration between Huawei and SMIC (Semiconductor Manufacturing...
AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...
Gallium arsenide (GaAs) power amplifier (PA) suppliers are gearing up for the industry's anticipated 2024 transition to Wi-Fi 7 (802.11be) wireless connectivity.
