On October 2, 2024, US President Joe Biden signed new legislation allowing semiconductor fabs funded under the CHIPS and Science Act to bypass federal environmental review requirements...
Amkor, a major US semiconductor packaging and testing company, received a US$400 million subsidy under the CHIPS Act to build a new plant in late July and will collaborate with TSMC...
The trio of Intel CEO Pat Gelsinger, US President Joe Biden, and Commerce Secretary Gina Raimondo are on a mission to restore the former glory of the US semiconductor industry.
Two days before SEMICON India 2024, the US Department of State said that the US and India will explore opportunities, grow, and diversify the global semiconductor supply chain.
Yung-Chung Kao, chairman of compound semiconductor manufacturer IntelliEPI, announced that the company has secured a subsidy of US$4.1 million under the Texas CHIPS Act, which will...
The scope of the US Chips Act appears to have exceeded that of the China Integrated Circuit Industry Investment Fund II (Big Fund II), but the American government's goal of reshoring...
Texas Instruments (TI) and the US Department of Commerce have signed a non-binding preliminary memorandum of terms for up to US$1.6 billion in proposed direct funding under the CHIPS...
SK Hynix is anticipated to expedite the development of its high-bandwidth memory (HBM) manufacturing and R&D fab in Indiana, with government incentives under the US CHIPS and...
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS...
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US,...
Amkor Technology has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act, according...
To strengthen semiconductor production capabilities across the Western Hemisphere, the U.S. Department of State, in collaboration with the Inter-American Development Bank (IDB), has...
On July 17, the Biden-Harris Administration announced a non-binding Preliminary Memorandum of Terms (PMT) between the US Department of Commerce and GlobalWafers America, LLC and MEMC...
