Taiwan ODM handset maker Compal Communications is bracing for a cloudy shipment outlook in the second half of 2009 as the company will be forced to postpone its shipments of smartphones...
Taiwan's Silicon Integrated System (SiS) has announced net losses of NT$6.29 billion (US$183.76 million) or NT$4.49 per share for 2008. The chipset maker plans to reduce its capital...
Silicon Integrated System (SiS) has recently gained orders from Pegatron Technology to supply 100,000 chipsets for Asustek Computer's Atom-based nettop products, according to a Chinese-language...
Silicon Integrated System (SiS) has announced its joining of the Power Forward Initiative (PFI) and plans to offer common power format (CPF) design solutions for its chipset, motherboard,...
VIA Technologies has announced the VIA VX855 media system processor (MSP) – a power efficient, all-in-one chipset that addresses the key performance and entertainment requirements...
Microsoft has teamed up with Taiwan-based IC design house MediaTek to develop Windows Mobile-enabled chipset solutions for smartphones, aiming to push 3G handsets built with MediaTek's...
Silicon Integrated System (SiS) has recently placed large volume of extra orders with United Microelectronics Corporation (UMC) to fulfill a shortage of its M672 chipsets for low-price...
Silicon Integrated System (SiS) has announced revenues of NT$177 million (US$5.1 million) for February this year, an increase of 35% compared to NT$131 million in January.
Intel and Taiwan Semiconductor Manufacturing Company (TSMC) are expected to hold a joint press conference on Monday in the US to make a "strategic announcement."
MediaTek is sampling its first smartphone solution, the MT6516, to clients for design-in, and is expected to begin volume production of the chipset, which supports both WCDMA and...
Gigabyte Technology has revealed more details about the three 10.1-inch netbooks – the Touch Note T1028, Booktop M1022, and Thin Note S1024 – that it plans to showcase...
Texas Instruments (TI) DLP Products has announced the latest chipset in the Pico family at the GSMA Mobile World Congress with availability slated for late 2009.
