Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has enjoyed strong demand for automotive...
China-based IC design house Will Semiconductor Shanghai generated revenues of CNY2.3 billion (US$356 million) from automotive CMOS image sensors (CIS) in 2021, hiking about 85% on...
It seems that CMOS image sensor (CIS) demand momentum for mainstream handset applications has become stagnant amid unclear market prospects, but the automotive CIS segment is emerging...
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
Semiconductor test equipment supplier Amida Technology has expressed optimism about its revenue prospects this year, citing strong demand from its customers engaged in the power amplifier...
International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...
Different IC segments will be experiencing mixed levels of price downward pressure at least in the first half of the year, according to industry sources.
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has expressed optimism that its strong shipments...
The rapid growth of automotive CMOS image sensors (CIS) has caused more security monitoring and consumer electronics manufacturers to enter the market.
A spike in COVID-19 cases in Hong Kong and other Chinese cities is disrupting handset CMOS image sensor (CIS) shipments, as well as deliveries of related modules and other devices,...
CMOS image sensor backend specialist Xintec has expressed caution about its sales performance this year, citing the ongoing pandemic, labor shortages, and supply-side challenges,...
IC testing house King Yuan Electronics (KYEC) has reiterated its revenue guidance for the first quarter of 2022 despite local COVID outbreaks at its production subsidiary in Suzhou,...
Chip sorting and die bonding equipment developer Saultech Technology has begun development of CIS (CMOS image sensor) packaging/testing equipment, according to industry sources.
Automotive CMOS image sensor (CIS) packaging capacity at Taiwan-based OSATs such as Tong Hsing Electronic Industries and Xintec remains fully loaded, and they can easily carry out...
With the Japan government stepping up their support for the local IC manufacturing sector, several new wafer fabs, including a joint venture (JV) between TSMC and Sony, will be constructed...
