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NEWS TAGGED CIS
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Monday 3 May 2021
TSMC ramping 28nm chip output despite cutback in orders from Sony
Despite weakened orders from Sony, TSMC still has been ramping up its 28nm chip output with plans to build additional production capacity at its Nanjing fab in China, according to...
Wednesday 28 April 2021
PTI to further expand DRAM backend capacity
Powertech Technology (PTI) plans to further expand production capacity for standard-type DRAM memory at its Xian plant in China to better serve major clients, according to the Taiwan-based...
Monday 26 April 2021
Tong Hsing to raise quotes for ceramic substrates later in 2Q21
Taiwan's backend house Tong Hsing Electronic Industries is set to raise quotes for ceramic substrates later in the second quarter of the year in response to increasingly strong demand...
Friday 9 April 2021
Backend houses see order visibility for CIS, sensor chips through 4Q21
Backend houses continue to enjoy strong demand for processing IP camera chips and CMOS image sensor (CIS) chips, with their order visibility clear through the fourth quarter of 2021,...
Friday 9 April 2021
IC and material distributors to embrace strong profit growth in 2021
Taiwan-based IC and material distributors are expected to see their profit growths this year outperform revenue increases, as shortages of IC parts and materials are sending prices...
Wednesday 7 April 2021
Strong sensor demand to buoy suppliers in 2021
Demand for CMOS image sensor (CIS) and other sensors is set to be robust this year, driven by a surge in demand for video conferencing, security surveillance and automotive electronics...
Friday 19 March 2021
Japan, Korea PCB makers shifting production focus to IC substrates
PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
Thursday 18 March 2021
Taiwan IC packaging-testing firms eyeing automotive CIS
As international design houses of smartphone-use CMOS image sensors (CIS) including Sony, Samsung Electronics, OmniVision and On Semiconductor have shifted 2021 business focus to...
Tuesday 16 March 2021
Backend firms to gain growth momentum from car chips till 3Q21
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
Wednesday 3 February 2021
Backend house Xintec expects strong 1Q21
TSMC-invested backend house Xintec expects to enjoy a particularly strong first-quarter 2021 and stable revenue and profit increases for the entire year, thanks to brisk wafer-level...
Wednesday 27 January 2021
PTI set to boost logic IC backend revenue ratio to 50% in mid-2021
Memory backend specialist Powertech Technology (PTI) is gearing up to expand its business in the logic IC field in 2021 with focus placed on flip-chip packaging and bumping services,...
Monday 25 January 2021
CIS chip suppliers tapping lucrative automotive, surveillance sectors
CMOS image sensor (CIS) suppliers are shifting their marketing strategies to focus more on automotive and surveillance applications seeking to ramp up profitability, according to...
Monday 25 January 2021
Automotive CIS backend business set to boom throughout 2021
Taiwan's CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries are poised to embrace major growth momentum throughout 2021 as they have landed one-year...