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NEWS TAGGED CMOS
Wednesday 30 October 2019
STAr Technologies introduces MEMS micro-cantilever probe cards for CMOS sensor test
STAr Technologies Inc, a leading supplier of semiconductor test probe cards, today announced the introduction of its new MEMS type micro-Cantilever probe card - STAr Aries Sigma-M,...
Monday 7 October 2019
Xintec eyeing return to profit in 2019
Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.
Wednesday 2 October 2019
Highlights of the day: CMOS sensor suppliers see strong demand from Huawei
The semiconductor supply chain is eyeing the robust demand from 5G commercialization. IC designers are designing chips supporting 5G, and in turn their backend partners are also gearing...
Wednesday 2 October 2019
Sony, OmniVision enjoy robust demand from Huawei
CMOS image sensor suppliers Sony and OmniVision have both enjoyed robust demand for multi-camera smartphones from Huawei, with their regional distributors and backend suppliers being...
Friday 30 August 2019
CMOS image sensors stay on stairway to record revenues, says IC Insights
Despite an expected slowdown in growth this year and in 2020, the CMOS image sensor market is forecast to continue reaching record-high sales and unit volumes through 2023 with the...
Friday 23 August 2019
Tong Hsing to see revenues rise through 4Q19
Tong Hsing Electronic Industries, which supplies ceramic substrates as well as packaging services for CMOS image sensors and other niche ICs, expects its revenues to pick up sequentially...
Friday 16 August 2019
Win Semi, Xintec and ShunSin ramping up shipments for 3D sensing components
GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter...
Wednesday 14 August 2019
Wafer-level backend demand promising
The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
Friday 26 July 2019
UMC, TeraSillC jointly roll out 24GHz CMOS radar transceiver chips
UnitedDS Semiconductor (UDS), a China-based IC design affiliate of United Microelectronics (UMC), and Taiwan's mmWave chip designer TeraSillC have jointly rolled out 24GHz radar transceiver...
Thursday 25 July 2019
SK Hynix posts sharp decreases in 2Q19 revenues and profits
SK Hynix saw its operating profits fall 89% from a year earlier to KRW638 billion (US$540.8 million) in the second quarter of 2019, when consolidated revenues slid 38% on year to...
Tuesday 9 July 2019
Taiwan chipmakers gearing up for 3D sensor market boom
Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...
Wednesday 3 July 2019
Foxconn set to build 12-inch wafer fab in 2020 as IDM
Foxconn Technology Group is likely to kick off construction of a 12-inch wafer fab in 2020 in Zhuhai, southern China in cooperation with the city government there, and will operate...
Monday 24 June 2019
Yageo chairman takes helm of Tong Hsing
Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...
Thursday 23 May 2019
Himax develops AI-based visual sensor for notebooks
Himax Technologies has introduced its ultra-low power, AI-based visual sensor for notebooks, with the solution already certified by Quanta Computer.
Tuesday 23 April 2019
Globalfoundries, On Semi agree to transfer ownership of 300mm fab in New York
Globalfoundries and ON Semiconductor have entered into a definitive agreement for ON Semi to acquire a 300mm fab located in East Fishkill, New York, according to the companies.